Prediction of thermo-mechanical properties of PCB conductive layers using convolutional neural networks

Shevchuk, Mariia; Schipfer, Christian; Haselmann, Matthias; Qi, Tao; Fuchs, Peter

doi:10.1109/eurosime56861.2023.10100776

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Prediction of thermo-mechanical properties of PCB conductive layers using convolutional neural networks

Cited by 2 publications

References 13 publications

An optimized hybrid finite element analyses - Artificial neural networks technique for estimating in-plane orthotropic mechanical properties of printed circuit boards

An optimized hybrid finite element analyses - Artificial neural networks technique for estimating in-plane orthotropic mechanical properties of printed circuit boards

A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies

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