Prediction of high cycle fatigue in aluminum bond wires: A physics of failure approach combining experiments and multi-physics simulations

Bielen, J.A.; Gommans, J.-J.; Theunis, F.

doi:10.1109/esime.2006.1644022

Cited by 30 publications

(16 citation statements)

References 6 publications

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“…Note the very small degree of scatter in the fatigue data, as well. Bielen et al 15 conducted temperature cycling on Al wires and obtained fatigue runout at a much lower stress of 10 MPa. It is likely that temperature cycling is more damaging since microstructural coarsening may also take place during fatigue.…”

Section: Resultsmentioning

confidence: 98%

Tensile and Fatigue Behavior of Al-1Si Wire Used in Wire Bonding

Danaher

Williams

Singh

et al. 2011

Journal of Elec Materi

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In this work, the mechanical properties of Al-1Si microelectronic wire were studied. The microstructure of the wire was examined to characterize the distribution of Al-Si inclusions and grain size. The wires had a diameter of 63.3 ± 0.1 lm and an elongated grain structure due to the hot extrusion process used to fabricate them. The transverse grain size was measured to be 1.1 ± 0.3 lm. The anisotropy in grain structure was characterized by dualbeam focused ion beam (FIB). The Young's modulus was measured by conducting experiments at various gage lengths. The measured modulus was 71.7 ± 6.1 GPa, similar to that of bulk Al-Si. Strength data were measured for many wires, and the variability evaluated by Weibull statistics. The wires had a strength slightly less than 200 MPa and strain to failure of over 2%. A Weibull modulus of 110 was obtained, indicating very low variability in the data. Stress versus fatigue cycles was also conducted. Specimens that survived 10 6 cycles exhibited a significant decrease in strength over the as-processed material. Fractographic analysis showed a significant amount of plastic flow and fracture by necking to a single point.

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Section: Resultsmentioning

confidence: 98%

Tensile and Fatigue Behavior of Al-1Si Wire Used in Wire Bonding

Danaher

Williams

Singh

et al. 2011

Journal of Elec Materi

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“…This phenomenon has already been widely described. For example, Meyyappan et al developed a wire fatigue model to predict failure due to flexure in wedge bonded power modules [11].…”

Section: Discussionmentioning

confidence: 99%

“…Refined meshing at the wire and especially the heel, as well as the contact area between the silicon die and the wire. Table 1 Typical thermal data of D 2 PAK materials [11,12].…”

Section: Discussionmentioning

confidence: 99%

Impact of aluminum wire and ribbon bonding technologies on D2PAK package reliability during thermal cycling applications

Jacques

Leroy

Lethiecq

2015

Microelectronics Reliability

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“…The stresses caused by the thermal, mechanical and electric voltage/currents greatly affect the long term reliability of these devices [2,3] . The reliability of a power supply is in general determined by the geometric design, choice of material and manufacturing technologies used.…”

Section: Introductionmentioning

confidence: 99%

Multi-physics simulation of high power supply used in the radar system

Pang

Chunjiang

2011

Proceedings of 2011 IEEE CIE International Conference on Radar

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The multi-physics fields in the working of power supply are calculated with finite element method. The analysis of simulation includes the coupling distributions of temperature, stress and electromagnetic fields. The results of simulation can be used to estimate the fatigue life and improve the design of high power supply used in the radar so as to enhance its performance of EMC, heat dissipation and structure intensity.

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Prediction of high cycle fatigue in aluminum bond wires: A physics of failure approach combining experiments and multi-physics simulations

Cited by 30 publications

References 6 publications

Tensile and Fatigue Behavior of Al-1Si Wire Used in Wire Bonding

Tensile and Fatigue Behavior of Al-1Si Wire Used in Wire Bonding

Impact of aluminum wire and ribbon bonding technologies on D2PAK package reliability during thermal cycling applications

Multi-physics simulation of high power supply used in the radar system

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