Prediction of Electrophysical and Magnetic Properties of Multicomponent (High-Entropy) Film Alloys

Abstract

At the phenomenological level, a theoretical analysis of the concentration dependence of the thermal resistance coefficient (Т), strain sensitivity coefficient (SC) and Curie temperature (С) for film high-entropy solid solutions based on Fe, Ni, Co, Cu, Cr was carried out. It was found that Т of 4-and 5-component film alloys varies within (1,00-1,75) . 10 -3 К -1 , and SC -(4.00-5.75) units, which corresponds well to the data for single-component metal films. It was concluded that, from the point of view of Т and SC, solid solutions of HEA have no advantage over single-component films, but they can be more effective sensitive elements of various sensors due to the thermal stability of the phase composition. The situation is different in the case of С, when С can decrease or increase by 350-400 K. Since the information about the HEA domain structure is limited, we assume that the domain structure is realized in magnetic granules based on Cu atoms. But in this case, the size effect can cause a С decrease, which, unfortunately, we could not take into account within our concept of additivity of the physical quantities of the solid solution of HEA.