2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and 2021
DOI: 10.1109/eurosime52062.2021.9410855
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Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics

Christian Schipfer
1
,
Mario Gschwandl
2
,
Peter Fuchs
3
et al.
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Cited by 3 publications
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References 16 publications
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An advanced, systematic simulation approach for studying warpage drivers of an assembled printed circuit board in early development stage

Frewein
1
,
Stojanović
2
,
Qi
3
et al. 2022
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and
6
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An advanced, systematic simulation approach for studying warpage drivers of an assembled printed circuit board in early development stage

Frewein
1
,
Stojanović
2
,
Qi
3
et al. 2022
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and
6
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0
0
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Pressing Simulations within the PCB Manufacturing Framework

Schipfer
1
,
Fuchs
2
,
Morak
3
et al. 2022
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and
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A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies

Kamble,
Patel,
Schipfer
et al. 2024
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and
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