Prediction of BGA solder joint array shape using improved Perzyna model and Anand model

Fang, Junxiong; Ran, Linjie; Huang, Wei; Pan, Kailin; Gong, Yubing

doi:10.1007/s40194-023-01596-2

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2024

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Cited by 3 publications

References 16 publications

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Numerical investigation of solder joint shape for micro-spring package during vacuum vapor phase soldering

Li,

2024

Microelectronics Reliability

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Numerical investigation of solder joint shape for micro-spring package during vacuum vapor phase soldering

Li,

2024

Microelectronics Reliability

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A predictive methodology for BGA solder joint formation and assembly defects

Bond,

Ahmad,

Teng

et al. 2024

2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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A Small Database with an Adaptive Data Selection Method for Solder Joint Fatigue Life Prediction in Advanced Packaging

Su,

Yuan,

Chiang

2024

Materials

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There has always been high interest in predicting the solder joint fatigue life in advanced packaging with high accuracy and efficiency. Artificial Intelligence Plus (AI+) is becoming increasingly popular as computational facilities continue to develop. This study will introduce machine learning (a core component of AI). With machine learning, metamodels that approximate the attributes of systems or functions are created to predict the fatigue life of advanced packaging. However, the prediction ability is highly dependent on the size and distribution of the training data. Increasing the amount of training data is the most intuitive approach to improve prediction performance, but this implies a higher computational cost. In this research, the adaptive sampling methods are applied to build the machine learning model with a small dataset sampled from an existing database. The performance of the model will be visualized using predefined criteria. Moreover, ensemble learning can be used to improve the performance of AI models after they have been fully trained.

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Prediction of BGA solder joint array shape using improved Perzyna model and Anand model

Cited by 3 publications

References 16 publications

Numerical investigation of solder joint shape for micro-spring package during vacuum vapor phase soldering

Numerical investigation of solder joint shape for micro-spring package during vacuum vapor phase soldering

A predictive methodology for BGA solder joint formation and assembly defects

A Small Database with an Adaptive Data Selection Method for Solder Joint Fatigue Life Prediction in Advanced Packaging

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