Predicting the thermal stability of RE-based bulk metallic glasses

Zhang, Ailong; Chen, Ding; Chen, Zhenhua

doi:10.1016/j.intermet.2009.06.009

Cited by 16 publications

(2 citation statements)

References 28 publications

(35 reference statements)

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“…The thermal aging of TFMG/TE couples was carried out below T g to ensure no crystallization occurs. The wide supercooled liquid region (∆ T x = T x − T g ) of TFMG implies a higher resistance to the nucleation and growth of crystalline phases upon annealing31. After long-term annealing, the TFMG remained well-adhered to the TE surface.…”

Section: Resultsmentioning

confidence: 99%

Thin-film metallic glass: an effective diffusion barrier for Se-doped AgSbTe2 thermoelectric modules

Deng

et al. 2017

Sci Rep

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The thermal stability of joints in thermoelectric (TE) modules, which are degraded during interdiffusion between the TE material and the contacting metal, needs to be addressed in order to utilize TE technology for competitive, sustainable energy applications. Herein, we deposit a 200 nm-thick Zr-based thin-film metallic glass (TFMG), which acts as an effective diffusion barrier layer with low electrical contact resistivity, on a high-zT Se-doped AgSbTe2 substrate. The reaction couples structured with TFMG/TE are annealed at 673 K for 8–360 hours and analyzed by electron microscopy. No observable IMCs (intermetallic compounds) are formed at the TFMG/TE interface, suggesting the effective inhibition of atomic diffusion that may be attributed to the grain-boundary-free structure of TFMG. The minor amount of Se acts as a tracer species, and a homogeneous Se-rich region is found nearing the TFMG/TE interface, which guarantees satisfactory bonding at the joint. The diffusion of Se, which has the smallest atomic volume of all the elements from the TE substrate, is found to follow Fick’s second law. The calculated diffusivity (D) of Se in TFMG falls in the range of D~10−20–10−23(m2/s), which is 106~107 and 1012~1013 times smaller than those of Ni [10−14–10−17(m2/s)] and Cu [10−8–10−11(m2/s)] in Bi2Te3, respectively.

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Section: Resultsmentioning

confidence: 99%

Thin-film metallic glass: an effective diffusion barrier for Se-doped AgSbTe2 thermoelectric modules

Deng

et al. 2017

Sci Rep

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“…A large number of novel RE-based BMGs, such as La-, Ce-, Er-, LaCe-, Y-, Sm-based BMGs, have been developed recently by choosing particular multi-component alloys with a strong tendency to form a glassy phase [2][3][4][5][6][7][8][9][10][11][12]. The tendency to form a glassy phase, i.e., the glass forming ability (GFA), is frequently evaluated by critical by critical cooling rate (R c ), which is the minimum cooling rate to obtain fully amorphous solid from melts, or the maximum attainable size (D max ) for glass formation, which strongly depends on the fabrication method used; the systems with R c less than approximately 10 5 K/s are regarded as high GFA alloys.…”

Section: Introductionmentioning

confidence: 99%

Investigation of glass forming ability in Ce–Al–Ni alloys

Tang

Pan

et al. 2012

Journal of Non-Crystalline Solids

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a b s t r a c tThe compositional dependence of the glass forming ability (GFA), the correlation between their GFA and the GFA related parameters, and the thermal stability of the Ce-Al-Ni alloys were investigated. Rapidly quenched Ce 65 Al x Ni 35 − x (x = 2, 5, 10, 17, 20) and Ce 70 Al x Ni 30 − x (x = 2, 5, 10, 15, 20) ribbons were prepared by melt spinning, and their phase transformations were studied by X-ray diffraction (XRD), transmission electron microscopy (TEM) and differential scanning calorimetry (DSC). The experimental results indicated that the GFA of Ce 65 Al x Ni 35 − x (x = 2, 5, 10, 17, 20) and Ce 70 Al x Ni 30 − x (x = 2, 5, 10, 15, 20) alloys increased firstly and then decreased with the increasing of the Al content up to 20 at.%, respectively. It was found that only one parameter, F 1 , in evaluated currently available empirical GFA parameters searching for metallic glasses with a good GFA, can reflect the GFA of the Ce-Al-Ni alloys. It was indicated that the thermal stability of alloy with fully amorphous maybe lower than that of alloy with partial amorphous.

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