Predicting the reliability of electronic equipment

Pecht, Michael; Nash, F. R.

doi:10.1109/5.293157

Cited by 129 publications

(37 citation statements)

References 21 publications

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“…-The models assume that the failure is independent of design, ignoring the components location on the PCB; however the component layout is known to have a large effect on performance [50]. -The empirical data collected contains many inaccuracies, data from first-generation components with unnaturally high failure rates, defective records of operating times, repair blunders, etc, which has resulted in low confidence in the results [51].…”

Section: Handbook Methodsmentioning

confidence: 99%

“…Handbook methods are relatively simple to implement, in that they do not require complex mathematical modelling, only part types, part counts, application environments and other readily available parameters, these parameters are then input into a model to calculate the MTBF. Despite its advantages Mil-Hdbk-217 is increasingly falling out of favour [12,17,42,50,51], a non-exhaustive list of the limitations are:…”

Section: Handbook Methodsmentioning

confidence: 99%

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Reliability Analysis of Electronic Equipment Subjected to Shock and Vibration – A Review

Amy

Aglietti

Richardson

2009

Shock and Vibration

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Abstract. Increasingly modern electronic equipment is expected to provide more functionality whilst still being able to withstand shock and vibration loads. The process of reliability prediction has been hampered by the complicated response and failure characteristics of electronic equipment, with the currently available methods being a compromise between accuracy and cost. A process to quickly and confidently predict the reliability of proposed electronic equipment to dynamic loads would greatly benefit industry. This paper will illustrate the difficulties in predicting electronic equipment reliability, showing why progress has been slow, in addition to the difficulty in making a model that works across a broad range of equipment configurations. The four classes of reliability prediction methods (Handbook, Test data, Field data and Physics of Failure) will be contrasted before addressing the individual methods.It is pertinent to note that although the majority of failures in electronic equipment are due to thermal issues, this review focuses on shock and vibration induced failures.

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Section: Handbook Methodsmentioning

confidence: 99%

Section: Handbook Methodsmentioning

confidence: 99%

Reliability Analysis of Electronic Equipment Subjected to Shock and Vibration – A Review

Amy

Aglietti

Richardson

2009

Shock and Vibration

View full text Add to dashboard Cite

show abstract

“…After that different firms and organizations developed and improve their own reliability handbooks and software. Some of these procedures include: In Reference [59], authors made a comparison between different methods available for estimating the reliability. Today, MIL-HDBK-217 handbook is still used as a reference for reliability estimation.…”

Section: Methodsmentioning

confidence: 99%

A Comparative Reliability Study of Three Fundamental Multilevel Inverters Using Two Different Approaches

2016

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Abstract:The reliability of power electronic devices and components is very important to manufacturers. In recent years, many researchers have conducted reliability assessments of power electronic devices, yet the reliability of numerous circuits used widely has not been evaluated. This paper presents a comprehensive reliability evaluation of fundamental multilevel inverters. The reliability of the multilevel inverters is analyzed by calculating the mean time to failure for each component. The calculation was performed by two methods (approximate and exact) to achieve better comparisons. The approximate method is similar to the parts count method used in MIL-HDBK-217 reliability standard, and the exact method exhibits the parts stress method. In the exact method, due to the direct relationship between component failure and temperature, we used Matlab Simulink to determine power losses in diodes and switches taking into account the temperature factor. The results determined by the approximate method showed that the three-level cascade H-bridge was the most reliable of the inverters considered. Although the exact method validates those results, and shows that cascade H-bridge (CHB) had a longer lifespan, but the calculated values are different. Therefore, using different approaches for evaluating reliability results in different outcomes.

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“…Increasing reliance on power electronics in such applications raises great concerns for equipment to be available when needed with a minimum risk of failure in service. Proper reliability assessment and prognostics methods that can be applied to power electronics are key enablers for achieving efficient system level maintenance and lower life cycle costs [1][2][3][4][5].…”

Section: Introductionmentioning

confidence: 99%

Mission Profile-Based Reliability Design and Real-Time Life Consumption Estimation in Power Electronics

Musallam

Yin

Bailey

et al. 2015

IEEE Trans. Power Electron.

139

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A note on versions:The version presented here may differ from the published version or from the version of record. If you wish to cite this item you are advised to consult the publisher's version. Please see the repository url above for details on accessing the published version and note that access may require a subscription.For more information, please contact eprints@nottingham.ac.ukManuscript ID TPEL-Reg-2014-04-0475.R2 1  Abstract-Power electronics are efficient for conversion and conditioning of the electrical energy through a wide range of applications. Proper life consumption estimation methods applied for power electronics that can operate in real-time under inservice mission profile conditions will not only provide an effective assessment of the products life expectancy but also they can deliver reliability design information. This is important to aid in manufacturing and thus help in reducing costs and maximizing through-life availability. In this paper, a mission profile based approach for real-time life consumption estimation which can be used for reliability design of power electronics is presented. The paper presents the use of electro-thermal models coupled with physics-of-failure analysis by means of real-time counting algorithm to provide accurate life consumption estimations for power modules operating under in-service conditions. These models, when driven by the actual mission profiles, can be utilized to provide advanced warning of failures and thus deliver information that can be useful to meet particular application requirements for reliability at the design stage. To implement this approach, an example of two case studies using mission profiles of a metro-system and wind-turbines applications are presented.

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Predicting the reliability of electronic equipment

Cited by 129 publications

References 21 publications

Reliability Analysis of Electronic Equipment Subjected to Shock and Vibration – A Review

Reliability Analysis of Electronic Equipment Subjected to Shock and Vibration – A Review

A Comparative Reliability Study of Three Fundamental Multilevel Inverters Using Two Different Approaches

Mission Profile-Based Reliability Design and Real-Time Life Consumption Estimation in Power Electronics

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