Predicting the Material Removal Rate in Chemical Mechanical Planarization Based on Improved Neural Network
Jianchao Wang,
Zhaoyang Shi,
Pingping Yu
et al.
Abstract:Chemical Mechanical Planarization (CMP) technology in integrated circuit manufacturing plays a critical role in realizing local and global flatness of silicon wafer surface. There are still some problems to be solved in industrial production, such as long period of CMP process debugging and various polishing materials, which lead to a more complicated Material Removal Rate (MRR) calculation during the CMP process. Based on the 2016 PHM Challenge dataset, this paper proposes a prediction method based on improve… Show more
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