Predicting solder joint reliability for thermal, power, and bend cycle within 25% accuracy

Syed, Ahmer

doi:10.1109/ectc.2001.927732

Cited by 87 publications

(40 citation statements)

References 3 publications

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“…Over the last couple of years much has been said and found out about solder fatigue especially due to the necessary transition to lead-free solders (Frear et al 1994;Wiese et al 2001;Schubert et al 2003;Hacke et al 1993;Syed 2001;Wunderle et al 2004a) using a damage mechanics approach. Usually, different solder specimens are taken to measure creep laws (primary and secondary creep, as e.g.…”

Section: Solder Fatiguementioning

confidence: 99%

Lifetime modelling for microsystems integration: from nano to systems

Wunderle

Michel

2009

Microsyst Technol

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Due to the rapid development of IC technology the traditional packaging concepts are making a transition into more complex system integration techniques in order to enable the constantly increasing demand for more functionality, performance, miniaturisation and lower cost. These new packaging concepts (as e.g. system in package, 3D integration, MEMS-devices) will have to combine smaller structures and layers made of new materials with even higher reliability. As these structures will more and more display nano-features, a coupled experimental and simulative approach has to account for this development to assure design for reliability in the future. A necessary ''nano-reliability'' approach as a scientific discipline has to encompass research on the properties and failure behaviour of materials and material interfaces under explicit consideration of their micro-and nano-structure and the effects hereby induced. It uses micro-and nano-analytical methods in simulation and experiment to consistently describe failure mechanisms over these length scales for more accurate and physically motivated lifetime prediction models. This paper deals with the thermo-mechanical reliability of microelectronic components and systems and methods to analyse and predict it. Various methods are presented to enable lifetime prediction on system, component and material level, the latter promoting the field of nano-reliability for future packaging challenges in advanced electronics system integration.

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Section: Solder Fatiguementioning

confidence: 99%

Lifetime modelling for microsystems integration: from nano to systems

Wunderle

Michel

2009

Microsyst Technol

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“…This procedure has another great advantage: The submodule is integral part of the model and not just 'sewed' into it (cf. [4]) by additional constraint equations, which may cause convergence problems. The mesh-density shown in Fig.1 represents an optimum value: It represents the minimum value for which the result does not depend on the density.…”

Section: Modular Parametric Fe-modellingmentioning

confidence: 99%

Modular parametric finite element modelling for reliability-studies in electronic and mems packaging

Wunderle

Auersperg²,

Grosser

et al. 2004

Microsystem Technologies

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A modular and parametric approach to FE-modelling is presented which allows rapid virtual prototyping for MEMS and other microelectronics packages with respect to some topical reliability issues: Thermal management and thermo-mechanical fatigue. Thereby the method of automatic model generation by modular parametric modelling is outlined and some examples featuring the required solution techniques are given. This simulation procedure forms part of a comprehensive design optimisation process in the field of predictive engineering. IntroductionA short time to market and increasing system reliability are important requirements for the new products in microelectronics and MEMS packaging. This can be achieved by methods of predictive engineering, e.g. by virtual prototyping. A very promising way to achieve this aim has been the wide-scale use of finite element (FE) tools: Simulations allow a physically motivated prediction of the function or state of loading of a component or system under certain testing conditions (e.g. temperature, humidity, vibration) already at the design stage. As these boundary conditions determine thermal and mechanical reliability [1, 2], the microsystem may be optimised by a systematic use of FE-analysis.This becomes all the more important as with a continuing miniaturisation from conventional microsystem technology down to nano-scale structures requirements for a reliable design tend to go up [3]. Then, as microsystems become more and more complex the modelling effort increases in order to capture and check for potentially important details. This task becomes very demanding if comprehensive parameter studies are required. In this respect modern computational lifetime prediction relies not only on short CPU-times but also on the versatility of the modelling approach. This means to what degree the model is capable to provide information about variations concerning the features of interest as there are: Geometry (dimensions, shape, details, tolerances), function (materials, type of analysis (physics), criticality and damage criteria) and numerical optimisation (smart and economic management of elements, reduction of model complexity) etc. This is where modular parametric finite element modelling can demonstrate its advantages. Modular parametric FE-modellingParametric modelling signifies that a model with certain geometric and/or functional properties can be generated automatically after specification of the corresponding parameters. Modular modelling means, that in this process one may draw upon standard geometry modules (e.g. a chip or a solder joint) which are scaled to the required size and incorporated ('glued') into the model at any desired position. Special models (as they are e.g. required for crack propagation) may also be embedded in the model and configured and meshed as needed. A reasonable separability into recurrent modules is obviously a prerequisite. These models may be stored in a library set up for this purpose.This approach enables an unrivalled flexibility as it allows to det...

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“…(Wunderle et al 2004b)] one averages over the region where damage occurs, avoid singularities and numerical effects at interfaces [see, e.g. (Syed 2001;Spraul et al 2007)]. In the case of a solder ball the failure definition is a through crack, therefore one averages over the whole diameter of the ball.…”

Section: A: Lifetime Model For Soldersmentioning

confidence: 99%

Thermo-mechanical reliability during technology development of power chip-on-board assemblies with encapsulation

et al. 2009

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In this paper we examine the thermo-mechanical reliability of polymer-encapsulated chip-on-board (COB) assemblies for power applications by simulation and experiment. Thereby the focus is set on the low cycle fatigue failure behaviour of the die-attach material under thermal cycling conditions. As die-attach material different solder materials and Ag-filled thermal adhesives have been used. The encapsulation was performed with a soft silicone-based and hard silica-reinforced epoxy-based material, respectively. An other process variable takes into account die-tilt. The study was carried out as a feasibility analysis in the course of a COB technology development. To this end lifetime models have been employed to correlate crack growth in the, i.e. attach to a computational accumulative failure criterion which allows to consistently describe ad predict quantitatively the lifetime of the assemblies. Thereby a considerable influence of the encapsulation was found. In particular it could be shown that a hard encapsulation largely increases reliability for solder die-attach

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Predicting solder joint reliability for thermal, power, and bend cycle within 25% accuracy

Cited by 87 publications

References 3 publications

Lifetime modelling for microsystems integration: from nano to systems

Lifetime modelling for microsystems integration: from nano to systems

Modular parametric finite element modelling for reliability-studies in electronic and mems packaging

Thermo-mechanical reliability during technology development of power chip-on-board assemblies with encapsulation

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