Predicting reliability of silicon MEMS

Fitzgerald, Alissa M.; Pierce, David M.; Zeyen, B.

doi:10.1117/12.845008

Cited by 4 publications

(3 citation statements)

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“…The silicon device layer of the SOI wafer is also etched by DRIE based on the Bosch process [18][19][20]. SF 6 and C 4 F 8 gases are used for etching and passivation, respectively.…”

Section: Nbe Etching Results and Discussionmentioning

confidence: 99%

Mechanical quality factor enhancement in a silicon micromechanical resonator by low-damage process using neutral beam etching technology

Toàn

Kubota

Sekhar

et al. 2014

J. Micromech. Microeng.

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The fabrication and evaluation of silicon micromechanical resonators using neutral beam etching (NBE) technology is presented. An etching technique based on a low energy neutral beam of Cl2/F2/O2 is introduced for making nano-trench patterns on 5 µm-thick silicon. The NBE technology has been investigated to form a highly-anisotropic etching shape. A 5 μm-deep trench pattern having smooth side walls with a gap width of 230 nm is achieved by using NBE. Additionally, a fabrication method for silicon resonators using NBE technology is proposed. The resonant frequency of the fabricated devices with a length of 500 μm, width of 440 μm and thickness of 5 μm is 9.66 MHz, and the average quality factor (Q) value is around 78 000. The devices fabricated by both deep reactive ion etching (DRIE) and NBE are evaluated and compared. The devices fabricated by NBE show that the motional resistances are reduced by almost 11 times from 645 kΩ to 59 kΩ and their output signals (insertion loss) are increased by approximately 15 dB in comparison with those fabricated by DRIE. Especially, devices fabricated by NBE provide the higher Q factors (average Q factor value of around 78 000) than those (average Q factor value of around 61 000) fabricated by DRIE in the same resonator parameters and measurement conditions.

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“…The silicon device layer of the SOI wafer is also etched by DRIE based on the Bosch process [18][19][20]. SF 6 and C 4 F 8 gases are used for etching and passivation, respectively.…”

Section: Nbe Etching Results and Discussionmentioning

confidence: 99%

Mechanical quality factor enhancement in a silicon micromechanical resonator by low-damage process using neutral beam etching technology

Toàn

Kubota

Sekhar

et al. 2014

J. Micromech. Microeng.

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show abstract

“…Alissa M. Fitzgerald proposed the first reliability quantification model for a general MEMS structure in 2009. Through the integration of failure probability on each surface of the MEMS structure, the overall reliability of the structure is obtained [119,120]. In 2011, Fitzgerald's model was further explored by proposing the concept of structural failure probability density (FPI).…”

Section: • Reliability Quantification For General Structuresmentioning

confidence: 99%

Reliability of MEMS in Shock Environments: 2000–2020

Peng

You

2021

Micromachines

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The reliability of MEMS in shock environments is a complex area which involves structural dynamics, fracture mechanics, and system reliability theory etc. With growth in the use of MEMS in automotive, IoT, aerospace and other harsh environments, there is a need for an in-depth understanding of the reliability of MEMS in shock environments. Despite the contributions of many articles that have overviewed the reliability of MEMS panoramically, a review paper that specifically focuses on the reliability research of MEMS in shock environments is, to date, absent. This paper reviews studies which examine the reliability of MEMS in shock environments from 2000 to 2020 in six sub-areas, which are: (i) response model of microstructure, (ii) shock experimental progresses, (iii) shock resistant microstructures, (iv) reliability quantification models of microstructure, (v) electronics-system-level reliability, and (vi) the coupling phenomenon of shock with other factors. This paper fills the gap around overviews of MEMS reliability in shock environments. Through the framework of these six sub-areas, we propose some directions potentially worthy of attention for future research.

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“…It can simulate the mechanical overload conditions that could develop, for instance, during the screen printing on silicon membrane arrays. The present setup employs modified bond test equipment with a design similar to that used by Fitzgerald et al to apply torsion loads on MEMS micromirrors [ 52 ]. A clear advantage of this setup over bulge testing [ 49 , 50 , 51 ] is its compatibility with automated test methods.…”

Section: Introductionmentioning

confidence: 99%

Optimization of a Low-Power Chemoresistive Gas Sensor: Predictive Thermal Modelling and Mechanical Failure Analysis

Gaiardo

Novel

Scattolo

et al. 2021

Sensors

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The substrate plays a key role in chemoresistive gas sensors. It acts as mechanical support for the sensing material, hosts the heating element and, also, aids the sensing material in signal transduction. In recent years, a significant improvement in the substrate production process has been achieved, thanks to the advances in micro- and nanofabrication for micro-electro-mechanical system (MEMS) technologies. In addition, the use of innovative materials and smaller low-power consumption silicon microheaters led to the development of high-performance gas sensors. Various heater layouts were investigated to optimize the temperature distribution on the membrane, and a suspended membrane configuration was exploited to avoid heat loss by conduction through the silicon bulk. However, there is a lack of comprehensive studies focused on predictive models for the optimization of the thermal and mechanical properties of a microheater. In this work, three microheater layouts in three membrane sizes were developed using the microfabrication process. The performance of these devices was evaluated to predict their thermal and mechanical behaviors by using both experimental and theoretical approaches. Finally, a statistical method was employed to cross-correlate the thermal predictive model and the mechanical failure analysis, aiming at microheater design optimization for gas-sensing applications.

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Predicting reliability of silicon MEMS

Cited by 4 publications

References 0 publications

Mechanical quality factor enhancement in a silicon micromechanical resonator by low-damage process using neutral beam etching technology

Mechanical quality factor enhancement in a silicon micromechanical resonator by low-damage process using neutral beam etching technology

Reliability of MEMS in Shock Environments: 2000–2020

Optimization of a Low-Power Chemoresistive Gas Sensor: Predictive Thermal Modelling and Mechanical Failure Analysis

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