2016
DOI: 10.1016/j.microrel.2016.03.016
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Predicting non-Fickian moisture diffusion in EMCs for application in micro-electronic devices

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Cited by 19 publications
(10 citation statements)
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“…Of particular importance is the Langmuir model [32], which has been recently extended to the three-dimensional, anisotropic hindered diffusion model (HDM) [38,39]. The Langmuir-type absorption model and the HDM were reported to be very accurate in describing the non-Fickian absorption [6,33,40], and were successful in predicting this anomalous behavior in thermoset-based adhesives, composites and molding compounds [6,10,32,33,[40][41][42][43][44][45].…”
Section: Moisture Absorption Theorymentioning
confidence: 99%
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“…Of particular importance is the Langmuir model [32], which has been recently extended to the three-dimensional, anisotropic hindered diffusion model (HDM) [38,39]. The Langmuir-type absorption model and the HDM were reported to be very accurate in describing the non-Fickian absorption [6,33,40], and were successful in predicting this anomalous behavior in thermoset-based adhesives, composites and molding compounds [6,10,32,33,[40][41][42][43][44][45].…”
Section: Moisture Absorption Theorymentioning
confidence: 99%
“…Due to these enhanced properties and their low density, nanocomposites have been used in a wide variety of industries, including aerospace [1,2], automotive [2,3], and energy [4,5]. In particular, thermosets contain nanoscale fillers or additives at different concentrations to reduce cost or to enhance electrical [3,6] mechanical [7][8][9] and/or barrier [8,[10][11][12][13] properties. The type (i.e., nanofibers, nanotubes, and nano-glass spheres) and the amounts of nanofillers used usually determine the extent of property enhancement.…”
Section: Introductionmentioning
confidence: 99%
“…Epoxy resin is widely employed in the insulation of electronic packaging due to its excellent heat resistance, outstanding manufacturability, and superior electrical insulation performance 1–4 . The development of miniaturized and high‐power density electronic devices necessitates higher requirements on epoxy resin insulating materials.…”
Section: Introductionmentioning
confidence: 99%
“…Moreover, the Langmuir model which was proposed by Cater et al [ 20 ] considers the probability of free and bound water molecules. This model has been adopted by various researchers when characterizing the non-Fickian moisture absorption behavior of FM300 epoxy adhesive [ 21 ], DGEBA-based epoxy adhesives [ 22 ], Fiberite ANC3K/948A1 graphite/epoxy composites [ 23 ], EC 2216 epoxy adhesive [ 24 ], Hysol EA9360 adhesive and T-300 plain weave reinforced epoxy composites [ 25 ], and biphenyl epoxy molding compounds [ 26 ]. The parallel Fickian model is another common model employed for non-Fickian behavior, where the moisture absorption is described by the summation of two Fickian models.…”
Section: Introductionmentioning
confidence: 99%
“…The parallel Fickian model is another common model employed for non-Fickian behavior, where the moisture absorption is described by the summation of two Fickian models. This model has been employed in a rubber toughened epoxy adhesive (Araldite 2007) [ 27 ] and epoxy molding compounds (EMCs) [ 26 , 28 , 29 ]. Nevertheless, the abovementioned non-Fickian models are limited to the specific experimental conditions designed by the authors.…”
Section: Introductionmentioning
confidence: 99%