Predicting mesoscale spectral thermal conductivity using advanced deterministic phonon transport techniques

Harter, Jackson R.; Palmer, Todd S.; Greaney, P. Alex

doi:10.1016/bs.aiht.2020.07.004

Cited by 7 publications

(6 citation statements)

References 74 publications

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“…However, it is known that the rule of mixtures overestimates the experimental value, since it does not consider interface features or defects that could act as an obstacle to heat conduction. [ 43 ] Electrons and phonons tend to scatter when trying to cross an interface, since the electronic and vibrational differences between two materials have an influence on the energy carrier. [ 44 ] Moreover, there is a resistive effect when the phonons are being transmitted across the boundary between two distinct materials, usually called the interface's resistance to thermal flow.…”

Section: Resultsmentioning

confidence: 99%

“…[ 43 ] Electrons and phonons tend to scatter when trying to cross an interface, since the electronic and vibrational differences between two materials have an influence on the energy carrier. [ 44 ] Moreover, there is a resistive effect when the phonons are being transmitted across the boundary between two distinct materials, usually called the interface's resistance to thermal flow. It means that the phonons can be reflected or transmitted at the interface and thus, some energy spreads out leading to a lower increase in the thermal conductivity (25%) than estimated by the rule of mixtures (38%).…”

Section: Resultsmentioning

confidence: 99%

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Multi‐Material Inconel 718 Parts with Highly Conductive Copper Cooling Channels for Aerospace Applications

et al. 2022

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Multi‐material parts can offer valuable solutions to engineering problems when compared to single materials. The conceptualization of a multifunctional Inconel 718 (IN718)–Copper (Cu) solution aims to improve the heat extraction capacity of an aerospace component. High‐strength IN718 was used as the base material and highly thermal conductive Cu was employed for internal cooling channels. The cooling channels are produced by electrical discharge machining (EDM) and subsequently filled with Cu to be sintered by hot pressing (HP). The morphological, microstructural, hardness, and thermal properties of the hot‐pressed multi‐material IN718–Cu specimens are studied to evaluate the feasibility of HP processing as a viable manufacturing approach for these multi‐material solutions. The multi‐material IN718–Cu specimens presents a well‐defined design with good metallurgical bonding between the two materials and a thin diffusion region is found, assuring the final properties of each individual material. The Vickers’ microhardness of IN178 and Cu are in accordance with the reported for conventional processes which indicates good densification. The thermal conductivity of the multi‐material IN718–Cu specimen is 25% higher than mono‐material IN718, which can be a significant improvement in the thermal efficiency of an aerospace component.

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Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

Multi‐Material Inconel 718 Parts with Highly Conductive Copper Cooling Channels for Aerospace Applications

et al. 2022

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“…As a result, the difference in K c was attributed to higher thermal resistance at the substrate/air interface in testing, which would increase the probability of phonon scattering. [75] Due to the higher surface area (i.e., 185, 164, and 141 mm 2 for < 32>, < 128>, and < 64 > respectively), the < 32 > samples were demonstrated to contain coolants as two-phase heat transfer that occurs in micro or nano-sized passages, making these con gurations increasingly essential to provide signi cant enhancement in heat management capabilities. Several cooling liquids, such as water, oil, and liquid metal (Ga-In-Sn), are commonly used in microelectronics packaging because of their higher heat dissipation e ciency.…”

Section: Thermal Dissipationmentioning

confidence: 99%

A multimaterial 3D printing-assisted micropatterning for heat dissipation applications

Jambhulkar

Ravichandran

Thippanna

et al. 2023

Adv Compos Hybrid Mater

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Micropatterned structures have applications in microchips, circuit board designs, micro uidics, evaporator/condenser coils, microelectronics, metasurfaces, and other functional devices. Conventional microfabrication techniques include lithography, vapor deposition, and laser writing. However, these methods have slow processing rates, complex requirements, or costly procedures. As a result, it is challenging to fabricate micropatterned structures onto large-scale surfaces with high production rates and resolution features. Thus, this study focuses on a non-conventional, mask-free micropatterning technique that combines bottom-up 3D printing capable of processing multiple materials and top-down wet etching for selective elimination of sacri cial material. The unique 3D printing, Multiphase Direct Ink Writing (MDIW), utilizes various polymer and nanoparticle systems as feedstocks for depositing lamellar structures containing sublayers of varying compositions (i.e., wet etchable sacri cial ink and ultravioletcurable patterning ink). The rapid phase transformation of photosensitive ink into solidi ed features enables "micro-con nement" of the sacri cial ink. Subsequently, wet etching can locally and selectively dissolve sacri cial polymers by solvent diffusion and polymer dissolution at the polymer-solvent interface. The parameter control (i.e., ink rheology, polymer-polymer interdiffusion, layer multiplication, phase transformation, and solvent-polymer interactions) can precisely tune the lamellar-groove transition, thus forming desirable surfaces or internal microstructures. Our MDIW 3D printing and its facilitation in surface micropatterning demonstrate the massive potential of distributing nanoparticles for dissipating thermal energies. With production scalability, operation simplicity, and multi-material compatibility, our 3D-printed micropatterning shows broader applications in nanoparticle assembly, drug delivery, optical lenses, intelligent microbots, and morphing objects.

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“…As a result, the difference in K c was attributed to higher thermal resistance at the substrate/air interface in testing, which would increase the probability of phonon scattering. [75] Due to the higher surface area (i.e., 185, 164, and 141 mm 2 for < 32>, < 128>, and < 64 > respectively), the < 32 > samples were demonstrated to contain coolants as two-phase heat transfer that occurs in micro or nano-sized passages, making these con gurations increasingly essential to provide signi cant enhancement in heat management capabilities. Several liquids, such as water, oil, and liquid metal (Ga-In-Sn), are commonly used in microelectronics packaging because of their higher heat dissipation e ciency.…”

Section: Thermal Dissipationmentioning

confidence: 99%

A Multi-Material 3D Printing-Assisted Micropatterning

Jambhulkar

Ravichandran

Thippanna

et al. 2023

Preprint

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Micropatterned structures have applications in microchips, circuit board designs, microfluidics, evaporator/condenser coils, microelectronics, metasurfaces, and other functional devices. Conventional microfabrication techniques include lithography, vapor deposition, and laser writing. However, these methods have slow processing rates, complex requirements, or costly procedures. As a result, it is challenging to fabricate micropatterned structures onto large-scale surfaces with high production rates and resolution features. Thus, this study focuses on a non-conventional, mask-free micropatterning technique that combines bottom-up 3D printing capable of processing multiple materials and top-down wet etching for selective elimination of sacrificial material. The unique 3D printing, Multiphase Direct Ink Writing (MDIW), utilizes various polymer and nanoparticle systems as feedstocks for depositing lamellar structures containing sublayers of varying compositions (i.e., wet etchable sacrificial ink and ultraviolet-curable patterning ink). The rapid phase transformation of photosensitive ink into solidified features enables "micro-confinement" of the sacrificial ink. Subsequently, wet etching can locally and selectively dissolve sacrificial polymers by solvent diffusion and polymer dissolution at the polymer-solvent interface. The parameter control (i.e., ink rheology, polymer-polymer interdiffusion, layer multiplication, phase transformation, and solvent-polymer interactions) can precisely tune the lamellar-groove transition, thus forming desirable surfaces or internal microstructures. Our MDIW 3D printing and its facilitation in surface micropatterning demonstrate the massive potential of distributing nanoparticles for dissipating thermal energies. With production scalability, operation simplicity, and multi-material compatibility, our 3D-printed micropatterning shows broader applications in nanoparticle assembly, drug delivery, optical lenses, intelligent microbots, and morphing objects.

show abstract

Predicting mesoscale spectral thermal conductivity using advanced deterministic phonon transport techniques

Cited by 7 publications

References 74 publications

Multi‐Material Inconel 718 Parts with Highly Conductive Copper Cooling Channels for Aerospace Applications

Multi‐Material Inconel 718 Parts with Highly Conductive Copper Cooling Channels for Aerospace Applications

A multimaterial 3D printing-assisted micropatterning for heat dissipation applications

A Multi-Material 3D Printing-Assisted Micropatterning

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