2014
DOI: 10.1007/s10086-014-1446-7
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Predicting internal bond strength of particleboard under outdoor exposure based on climate data: comparison of multiple linear regression and artificial neural network

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Cited by 17 publications
(15 citation statements)
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References 27 publications
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“…These modeling approaches have been also employed for predicting strength properties of wood and wood products. The applications regarding strength prediction in wood science can be listed as follows: Esteban et al [19]; Esteban et al [10]; Fernandez et al [8]; Eslah et al [20]; Tiryaki and Aydin [21]; Tiryaki et al [22]; and Watanabe et al [23].…”
mentioning
confidence: 99%
“…These modeling approaches have been also employed for predicting strength properties of wood and wood products. The applications regarding strength prediction in wood science can be listed as follows: Esteban et al [19]; Esteban et al [10]; Fernandez et al [8]; Eslah et al [20]; Tiryaki and Aydin [21]; Tiryaki et al [22]; and Watanabe et al [23].…”
mentioning
confidence: 99%
“…The higher the RMSE value, the less accurate the model is. Thus, the β~(β >4 , β 4-3 ) model seems to be slightly inferior, though both can be considered correct [18]. These models confirm that the buffering capacity of chip suspension under the boundary of pH 4 becomes irrelevant for the study.…”
Section: Abc Methodologymentioning
confidence: 69%
“…The tensile strength perpendicular to the surface of a board is considered a measure of the internal bond (IB) of the particleboard that is strongly correlated with the strength of the adhesive bond between the chips in a panel [18][19][20][21][22]. Therefore, the IB was involved in building a correlation with the ABC of the chips used as the raw material in the particleboard preparation.…”
Section: Abc Effectmentioning
confidence: 99%
“…The eight sites selected were Asahikawa, Noshiro, Morioka, Tsukuba, Maniwa, Okayama, Shizuoka, and Miyakonojo (Table 1). Recently results have been reported by the authors' research group (Korai et al , 2014aKorai 2012;Korai and Hattori 2013;Korai and Saotome 2014;Watanabe et al 2014;Korai and Watanabe 2015;Kojima et al 2009Kojima et al , 2012Kojima and Suzuki 2011a, b;Sekino et al 2014).…”
Section: Introductionmentioning
confidence: 90%