Precision scans of the Pixel cell response of double sided 3D Pixel detectors to pion and X-ray beams

Raighne, A. Mac; Alianelli, Lucia; Bates, R. L.; Beuzekom, M. van; Buytaert, J.; Campbell, M.; Collins, P.; Crossley, M.; Dumps, Raphael; Eklund, L.; Fleta, C.; Gallas, A.; Gersabeck, M.; Gimenez, E.N.; Gligorov, V. V.; John, M.; Llopart, X.; Lozano, M.; Maneuski, D.; Marchal, J.; Nicol, M.; Plackett, R.; Parkes, C.; Pellegrini, G.; Pennicard, David; Rodrigues, E.; Stewart, G. A.; Sawhney, Kawal; Tartoni, N.; Tlustos, L.

doi:10.1088/1748-0221/6/05/p05002

Cited by 15 publications

(15 citation statements)

References 18 publications

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“…As the efficiency variation across a unit pixel cell of the 3D sensor at perpendicular incidence is the main topic of the companion paper [1], only a brief description is provided here. As discussed in the introduction, the 3D sensor has a series of inactive columns, and for a perpendicular beam no charge would be collected in the centre of these columns.…”

Section: D Sensor Efficiency Resultsmentioning

confidence: 99%

“…In both cases the distribution is seen to be separated from the noise floor, but closer to the threshold than in the case of the planar sensor. The detailed characteristics of the Landau distribution are discussed more extensively in the companion paper [1].…”

Section: Double Sided 3d Sensor Landau Distributionsmentioning

confidence: 99%

“…The resolution of the double-sided 3D sensor is shown in Figure 28 as a function of the angle of rotation of the sensor. As shown in [1], the 3D sensor has relatively little charge sharing compared with a planar sensor. This is expected from the self-shielding electricfield geometry of the 3D sensor.…”

Section: D Sensor Normal Angle Scansmentioning

confidence: 99%

“…The telescope was also used to measure the performance of a 3D sensor bonded to a Timepix chip, which represents an option for radiation hard SLHC applications. The same 3D sensor was also tested in an X-ray beam, and the results are reported in the companion paper [1]. Due to the excellent performance of the Timepix telescope, it was possible to perform a detailed investigation of the resolution, efficiency and charge sharing performance of the devices under test.…”

Section: Introductionmentioning

confidence: 99%

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Charged particle tracking with the Timepix ASIC

Akiba

Artuso

Badman

et al. 2012

Nuclear Instruments and Methods in Physics Research Section A:

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A prototype particle tracking telescope has been constructed using Timepix and Medipix ASIC hybrid pixel assemblies as the six sensing planes. Each telescope plane consisted of one 1.4 cm 2 assembly, providing a 256×256 array of 55 µm square pixels. The telescope achieved a pointing resolution of 2.3 µm at the position of the device under test. During a beam test in 2009 the telescope was used to evaluate in detail the performance of two Timepix hybrid pixel assemblies; a standard planar 300 µm thick sensor, and 285 µm thick double sided 3D sensor. This paper describes a detailed charge calibration study of the pixel devices, which allows the true charge to be extracted, and reports on measurements of the charge collection characteristics and Landau distributions. The planar sensor achieved a best resolution of 4.0 ± 0.1 µm for angled tracks, and resolutions of between 4.4 and 11 µm for perpendicular tracks, depending on the applied bias voltage. The double sided 3D sensor, which has significantly less charge sharing, was found to have an optimal resolution of 9.0 ± 0.1 µm for angled tracks, and a resolution of 16.0 ± 0.2 µm for perpendicular tracks. Based on these studies it is concluded that the Timepix ASIC shows an excellent performance when used as a device for charged particle tracking.2

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Section: D Sensor Efficiency Resultsmentioning

confidence: 99%

Section: Double Sided 3d Sensor Landau Distributionsmentioning

confidence: 99%

Section: D Sensor Normal Angle Scansmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Charged particle tracking with the Timepix ASIC

Akiba

Artuso

Badman

et al. 2012

Nuclear Instruments and Methods in Physics Research Section A:

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“…This is due to the low charge sharing present in the 3D detector structure. More details of the test beam analysis can be found in [22].…”

Section: D Detector Test Beam Analysismentioning

confidence: 99%

3D Detectors

Bates¹

2012

Proceedings of the 20th Anniversary International Workshop on Vertex Detectors — PoS(Vertex 2011)

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The 3D detector was conceived as a method to overcome the radiation induced reduction in charge carrier lifetimes in heavily irradiated silicon detectors via the use of advanced MEMS device fabrication techniques. This paper reviews the state of the art in 3D detectors. Work performed within the major fabrication institutes will be discussed. This includes modifications to the original proposed design to reduce complexity and therefore increase device yield. The impact on performance of such modifications will be covered. Characterisation and performance of 3D detectors up to the maximum radiation fluence expected at the high luminosity LHC operation will be presented and compared to simulations. Results from both strip and pixel devices will be shown using characterisation methods that include 90-Sr Betas, focused laser and high-energy particle beams.

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