2016
DOI: 10.2494/photopolymer.29.705
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Precise Synthesis of Fluorine-containing Block Copolymers via RAFT

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Cited by 6 publications
(8 citation statements)
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“…The lamella-forming PMAPOSS 6 - b -PTFEMA 80 ( M n = 18 300 g mol –1 , Đ = 1.13, f PMAPOSS = 0.31, d -spacing = 16.2 nm) was synthesized via RAFT as previously reported. , Thin films of PMAPOSS 6 - b -PTFEMA 80 were prepared by spin-coating 3 wt % chloroform solutions onto Si wafers and annealed on hot plates. To enhance the contrast in AFM measurements, PTFEMA segments were partially removed by reactive ion etching (oxygen, O 2 -RIE) (power: 20 W, O 2 flow: 20 sccm, time: 2 s).…”
Section: Methodsmentioning
confidence: 99%
See 1 more Smart Citation
“…The lamella-forming PMAPOSS 6 - b -PTFEMA 80 ( M n = 18 300 g mol –1 , Đ = 1.13, f PMAPOSS = 0.31, d -spacing = 16.2 nm) was synthesized via RAFT as previously reported. , Thin films of PMAPOSS 6 - b -PTFEMA 80 were prepared by spin-coating 3 wt % chloroform solutions onto Si wafers and annealed on hot plates. To enhance the contrast in AFM measurements, PTFEMA segments were partially removed by reactive ion etching (oxygen, O 2 -RIE) (power: 20 W, O 2 flow: 20 sccm, time: 2 s).…”
Section: Methodsmentioning
confidence: 99%
“…Recently, we designed a silicon- (Si) and fluorine-containing BCP, poly­(polyhedral oligomeric silsesquioxane methacrylate- block -2,2,2-trifluoroethyl methacrylate) (PMAPOSS- b -PTFEMA) capable of forming sub-10 nm perpendicular lamellae on thin films using simple thermal annealing. The χ eff of PMAPOSS- b -PTFEMA was estimated to be 0.45, one of the largest values reported to date. Additionally, the components exhibited balanced interfacial affinities relative to both the free surface and Si substrates at a wide variety of temperatures of around 100 °C.…”
mentioning
confidence: 99%
“…[5] By using perpendicular lamellar structures on high-χ BCP thin films, line and space (L/S) patterns with sub-10 nm facilitating the formation of perpendicular structures. [6,10,[27][28][29][30] Furthermore, earlier studies have focused on the self-assembly behavior of polystyrene-block-poly(methyl methacrylate) (PSb-PMMA). Despite being the industrial workhorse for BCP lithography, PS-b-PMMA has a low strength of segregation and is incapable of forming sub-10 nm features.…”
Section: Introductionmentioning
confidence: 99%
“…[6,27,30] The organic-inorganic blocks also increase the segregation strength and etch contrast between the blocks, allowing for the formation of sub-10 nm structures. The similar and low SFEs of both blocks (SFE PTFEMA, 19 °C = 24.0 mJ m −2 , SFE PMAPOSS, 19 °C = 30.4 mJ m −2 ) facilitate the formation of perpendicular lamellae on bare Si substrates without chemically modifying layers via simple thermal annealing.…”
Section: Introductionmentioning
confidence: 99%
“…PS-PMMA is the typical DSA material [5][6][7][8][9]. For smaller-size patterning, high-chi block copolymers are required [10][11][12][13][14][15][16][17].…”
Section: Introductionmentioning
confidence: 99%