Precipitation and coarsening of bismuth plates in Sn–Ag–Cu–Bi and Sn–Cu–Ni–Bi solder joints

Belyakov, S. A.; Xian, J.W.; Zeng, Guang; Sweatman, Keith; Nishimura, Tetsuro; Akaiwa, Tetsuya; Gourlay, C.M.

doi:10.1007/s10854-018-0302-8

Cited by 25 publications

(9 citation statements)

References 48 publications

(59 reference statements)

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“…The preferred growth of precipitates along the cdirection in b-Sn has been previously reported for SbSn phase 50 as well as for (Bi) phase. 51 One of the underlying reasons for this preferred growth direction might be that [001] is the fastest diffusion direction in the b-Sn crystal for a number of solute elements such as Cu, Ni, Ag and Au. [52][53][54] McCabe et al have previously explored the precipitation of rectangular nano-whiskers of SbSn phase ($ 126 nm 9 126 nm 9 3-5 lm) in Sn-5.8 wt.%Sb and Sn-8.1 wt.%Sb specimens quenched and heattreated at room temperature.…”

Section: Sbsn Precipitation and Coarseningmentioning

confidence: 99%

Microstructure and Damage Evolution During Thermal Cycling of Sn-Ag-Cu Solders Containing Antimony

Belyakov

Coyle

Arfaei

et al. 2020

Journal of Elec Materi

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Antimony is attracting interest as an addition to Pb-free solders to improve thermal cycling performance in harsher conditions. Here, we investigate microstructure evolution and failure in harsh accelerated thermal cycling (ATC) of a Sn-3.8Ag-0.9Cu solder with 5.5 wt.% antimony as the major addition in two ball grid array (BGA) packages. SbSn particles are shown to precipitate on both Cu6Sn5 and as cuboids in β-Sn, with reproducible orientation relationships and a good lattice match. Similar to Sn-Ag-Cu solders, the microstructure and damage evolution were generally localised in the β-Sn near the component side where localised β-Sn misorientations and subgrains, accelerated SbSn and Ag3Sn particle coarsening, and β-Sn recrystallisation occurred. Cracks grew along the network of recrystallised grain boundaries to failure. The improved ATC performance is mostly attributed to SbSn solid-state precipitation within β-Sn dendrites, which supplements the Ag3Sn that formed in a eutectic reaction between β-Sn dendrites, providing populations of strengthening particles in both the dendritic and eutectic β-Sn.

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Section: Sbsn Precipitation and Coarseningmentioning

confidence: 99%

Microstructure and Damage Evolution During Thermal Cycling of Sn-Ag-Cu Solders Containing Antimony

Belyakov

Coyle

Arfaei

et al. 2020

Journal of Elec Materi

Self Cite

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“…At present, SnAgCu lead-free solder in which Bi is solid-solved has been proposed due to requirements for higher reliability. 4) However, material properties of this alloy type solder at low temperatures have not been almost reported. 5,6) Generally, material properties of solder materials have been evaluated with the relative large size specimen specified in JIS Z 3198-2 in Japan.…”

Section: Introductionmentioning

confidence: 97%

Effect of Bi Addition on Tensile Properties of Sn–Ag–Cu Solder at Low Temperature

et al. 2019

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In order to examine the effect of the Bi addition on tensile properties of SnAgCu solder at low temperatures, stress-strain diagrams were acquired by tensile tests at 233 K using miniature size specimens. Stress drops were observed in the stress-strain diagram of SnAgCuBi solder before it lead to a break. Similar phenomenon did not observed in the SnAgCu solder. The stress drops was exceptionally sharp in the SnAgCu solder with added 3 mass% Bi, compared to the solder with added 1 or 2 mass% Bi. The mode of the stress drop is depended on twin deformation. On the contrary, similar stress drop phenomenon was not observed in any stress-strain diagrams at 298 K. From the results of grain map analysis, it was found that many twin deformations occur in the specimen in which exceptional sharp stress drops appear in the stress-strain diagram.

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“…Thus, introducing solid solution strengthening into precipitation hardening tin based alloys can effectively improve the high temperature resistance of the β-Sn matrix [20,21]. For β-Sn matrix, solid solution strengthening can be achieved by Bi, Sb, In without obvious oxidation [4,15,22,23].…”

Section: Introductionmentioning

confidence: 99%

Microstructures and shear properties of Sb and In strengthened Sn5Bi/Cu joints

Zhang,

Zhao,

Wang

et al. 2023

Preprint

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The effects of x(Sb/In) (x = 1, 2, 3 wt.%) added to Sn5Bi solder alloy on the melting properties, microstructures and the shear behavior of solder/Cu joints were investigated combined with the corresponding phase diagram. It is found that the addition of Sb reduces the melting range and supercooling with the increase of Sb content caused by SnSb formation, while the In addition can reduce the melting point resulted by In solid solution. Both Sn5BixIn/Cu and Sn5BixSb/Cu are mainly composed of β-Sn and two types precipitates, i.e. Bi particles and Cu6Sn5 compound. The difference lies in that In doping only can dissolve into β-Sn and Cu6Sn5 while Sb doping mainly form tiny SnSb. Increase In content also inhibit precipitation of Bi particles and reduce the phase fraction Cu6(SnIn)5, resulting in that precipitation strengthening becomes weaker and solid solution strengthening becomes stronger. In contrast, the phase fraction of Bi particles and Cu6Sn5 increases with increasing Sb content, leading to that precipitation strengthening becomes stronger. These strengthening mechanism causes that their ultimate shear force monotonically increases with increasing Sb and In content, and the strengthening effect of the Sb element is better. Sb and In addition also can improve the ductility of Sn5Bi/Cu solder joints and both 2 wt.% In/Sb addition present the best shear fracture work. Thus, the optimal mechanical property was achieved by 2 wt.% Sb addition.

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Precipitation and coarsening of bismuth plates in Sn–Ag–Cu–Bi and Sn–Cu–Ni–Bi solder joints

Cited by 25 publications

References 48 publications

Microstructure and Damage Evolution During Thermal Cycling of Sn-Ag-Cu Solders Containing Antimony

Microstructure and Damage Evolution During Thermal Cycling of Sn-Ag-Cu Solders Containing Antimony

Effect of Bi Addition on Tensile Properties of Sn–Ag–Cu Solder at Low Temperature

Microstructures and shear properties of Sb and In strengthened Sn5Bi/Cu joints

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