2009 59th Electronic Components and Technology Conference 2009 Help me understand this report
Practical assessment of tin whisker growth risk due to environmental temperature variations
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“…A study using SOT3 component A and SOT3 component B, which both had the same Alloy 42 lead frames but different matte Sn component finish from different component suppliers, was done to evaluate this effect [9].…”
Section: Effect Of Solder Paste Volume On Component Tin Whisker Growtmentioning
confidence: 99%
“…A study using SOT3 component A and SOT3 component B, which both had the same Alloy 42 lead frames but different matte Sn component finish from different component suppliers, was done to evaluate this effect [9].…”
Section: Effect Of Solder Paste Volume On Component Tin Whisker Growtmentioning
confidence: 99%
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