Powercycling Reliability, Failure Analysis and Acceleration Factors of Pb-Free Solder Joints

Setty, K.; Subbarayan, Ganesh; Nguyen, Luu

doi:10.1109/ectc.2005.1441380

Cited by 16 publications

(5 citation statements)

References 19 publications

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“…Higher levels of voids are reported in lead‐free solder joints than eutectic SnPb joints. Voids degrade electrical, mechanical, and thermal properties of solder joints (Setty et al , 2005). Interfacial preexisting voids can accelerate electromigration failures, which can reduce over a half of the solder joint lifetime with a 20 percent volume fraction of interfacial voids (Tang and Shi, 2001).…”

Section: Introductionmentioning

confidence: 99%

Characterization of SnAgCu and SnPb solder joints on low‐temperature co‐fired ceramic substrate

Zhong

Arulvanan

Maw

et al. 2007

Soldering &Amp; Surface Mount Technology

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PurposeThe purpose of this paper is to present the results of experiments performed to attach silicon dies (chips) to low‐temperature co‐fired ceramic (LTCC) substrates with Ag or AgPd pads using SnAgCu or SnPb solder and the results of the characterization of the solder joints.Design/methodology/approachLTCC substrates were fabricated by stacking and laminating four green tapes with the top layer screen‐printed with Ag or AgPd paste to form pads. Silicon die sizes of 1 × 1 mm and 2 × 2 mm with electroless nickel immersion gold plated were soldered to 2 × 2 mm pads on the LTCC substrates using SnPb or SnAgCu solder. The solder joints were then characterized using X‐ray, die shear, energy dispersive X‐ray and scanning electron microscopy techniques.FindingsThe joints made by AgPd pads with SnAgCu solder provided the best results with the highest shear strength having strong interfaces in the joints. However, the joints of Ag pads with SnPb solder did not provide high‐shear strength.Originality/valueThe findings provide certain guidelines to implement LTCC applications. AgPd pads with SnAgCu solder can be considered for applications where small silicon dies need to be attached to LTCC substrates. However, Ag pads with SnAgCu solder can be considered for lead‐free solder applications.

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Section: Introductionmentioning

confidence: 99%

Characterization of SnAgCu and SnPb solder joints on low‐temperature co‐fired ceramic substrate

Zhong

Arulvanan

Maw

et al. 2007

Soldering &Amp; Surface Mount Technology

View full text Add to dashboard Cite

show abstract

“…Further, according to previous research, the fatigue life is most sensitive to the hot dwell time that ranges between 5 to 10 minutes. Effect of hot dwell time on creep damage accumulation is insignificant when it is beyond 10 minutes [2].…”

Section: Loads and Boundary Conditionsmentioning

confidence: 98%

“…Research has been carried out to decide upon the dwell time used in the powercycling. Since most of the creep damage accumulation takes place during the hot dwell [2]. The longer hot dwell results in higher accumulation of inelastic strain and a shorter fatigue life.…”

Section: Loads and Boundary Conditionsmentioning

confidence: 99%

“…However, in recent years, there is an increasing debate on the applicability of thermal cycling tests for reliability studies since under the actual operating conditions, the heat is generated by a powered electronic device, and as a result, the package is under anisothermal conditions [2]. Thus, it is believed that powercycling accelerated tests, which result in uneven heating of electronic packages, represents service conditions more realistically.…”

Section: Introductionmentioning

confidence: 99%

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Creep damage study at powercycling of lead-free surface mount device

Hegde

Whalley

Silberschmidt

2009

Computational Materials Science

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Soldering is extensively used to assemble electronic components to printed circuit boards or chips to a substrate in microelectronic devices. These solder joints serve as mechanical, thermal and electrical interconnections, therefore, their integrity is a key reliability concern.However, newly introduced lead-free solders do not have a long history of applications in the industry and there is a lack of established material models of their behaviour over the wide temperature range experienced by electronics systems. Therefore, an extensive reliability study is required before introducing a new lead-free solder material in the electronic industries. Moreover, most of the solder materials have low melting temperatures, and are prone to creep in service. The cyclic temperature operating condition (powercycling) of the solder joint can result in the creep fatigue failure. Thus, a computational technique is used to investigate creep damage in solder joints. The present paper deals with creep damage of leadfree solder joints for powercycling using finite element analysis with the consideration of experimentally observed non-uniform temperature distributions in the 1206 surface mount chip resistor. In addition, a comparison is made for inelastic strain accumulation and fatigue life for creep damage study for spatially uniform and non-uniform temperature powercycling.

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“…This is mainly due to the cyclic temperature changes caused by the switching between fully operational and sleep modes (i.e., thermal cycling). Such variations can accelerate the deterioration of a device [7,10,11], in particular its solder joints [12].…”

Section: Introductionmentioning

confidence: 99%

Energy Efficiency Versus Reliability Performance in Optical Backbone Networks [Invited]

Wiatr

Chen

Monti

et al. 2015

J. Opt. Commun. Netw.

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Improving the energy efficiency in telecommunication networks has been one of the main research topics of the past few years. As a result, many energy efficient algorithms have been proposed, some focusing on maximizing only the energy savings, others considering also the impact that green strategies have on other network performance metrics, e.g., delay, utilization of network resources, and blocking probability. The aim of this paper is to provide new insight on the impact of energy efficient strategies, i.e., investigating the trade-off between green network operations and the reliability performance of optical backbone devices. The study is motivated by the intuition that energy efficient strategies are usually based on putting unutilized devices in power saving (sleep) mode, which can have some side effects (e.g., frequent on/sleep switching, and/or high fiber link utilization) that may affect the working conditions of a device. To better understand these phenomena, this paper presents a number of models aimed at estimating the reliability performance changes of a device as a function of its average working temperature, of its temperature variations, and of its average occupancy. These models are then used to carry out a study both at the component and at the network levels. The study at the component level shows that erbium-doped fiber amplifiers (EDFAs) are critical devices, i.e., their achievable energy savings might not cover the additional reparation costs resulting from their reliability performance degradation. Similar findings are reached also with the network level study. In summary, it can be concluded that the use of energy efficient routing algorithms based on setting EDFAs in sleep mode may not always be beneficial.

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Powercycling Reliability, Failure Analysis and Acceleration Factors of Pb-Free Solder Joints

Cited by 16 publications

References 19 publications

Characterization of SnAgCu and SnPb solder joints on low‐temperature co‐fired ceramic substrate

Characterization of SnAgCu and SnPb solder joints on low‐temperature co‐fired ceramic substrate

Creep damage study at powercycling of lead-free surface mount device

Energy Efficiency Versus Reliability Performance in Optical Backbone Networks [Invited]

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