Power-efficient high-frequency integrated circuits and communication systems developed within Cool Silicon cluster project

Ellinger, Frank; Fettweis, Gerhard; Tzschoppe, Christoph; Carta, Corrado; Fritsche, David; Tretter, Gregor; Yodprasit, Uroschanit; Paulo, Robert; Richter, Andreas; Strobel, Axel; Wolf, Robert; Fehske, Albrecht; Isheden, Christian; Pawlak, Andreas; Schröter, M.; Schumann, Stefan; Höppner, Sebastian; Walter, Dennis; Eisenreich, Holger; Schüffny, René

doi:10.1109/imoc.2013.6646416

Search citation statements

Order By: Relevance

Paper Sections

Select...

Parameter Extraction Methods1

Introduction1

Citation Types

Supporting

Mentioning

Contrasting

Year Published

2014

Publication Types

Select...

Article1

Relationship

Self Cite0

Independent1

Authors

Journals

Cited by 1 publication

(2 citation statements)

References 11 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Following the assumption made with respect to the equality of the fingers' thermal resistances, (9) and (14) can be inserted into (13), and rearranging toward the coupling factors yields…”

Section: Parameter Extraction Methodsmentioning

confidence: 99%

“…To overcome these issues, here a methodology based on a simple test structure, electrical dc measurements only, and a calibrated fast solution of the heat transport equation is proposed. This approach allows for generating thermal networks for various emitter geometries and is applied to SiGe-HBTs of a standard BiCMOS-technology [8] that is suitable for state-of-the-art circuit design [9], [10].…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Characterization of the Static Thermal Coupling Between Emitter Fingers of Bipolar Transistors

Lehmann

Zimmermann

Pawlak

et al. 2014

IEEE Trans. Electron Devices

View full text Add to dashboard Cite

A strategy for compact modeling the static thermal coupling between the emitter fingers of SiGe heterojunction bipolar transistors (SiGe-HBTs) is described. An extraction methodology that includes the nonlinear temperature dependence of the thermal conductivity is introduced and applied to suitable test structures. The experimental results are used for calibrating a 3-D numerical solution of the equation for heat conduction based on a Green's function approach. The latter can then be employed for generating thermal coupling networks for arbitrary transistor configurations.

show abstract

“…Following the assumption made with respect to the equality of the fingers' thermal resistances, (9) and (14) can be inserted into (13), and rearranging toward the coupling factors yields…”

Section: Parameter Extraction Methodsmentioning

confidence: 99%