Power Cycling Reliability with Temperature Deviation of Pressureless Silver Sintered Joint for Silicon Carbide Power Module
Won Sik Hong,
Mi Song Kim
Abstract:SiC devices can enhance power conversion in electric vehicles. However, traditional soldering techniques are limited by their low melting temperatures. Therefore, we used pressureless Ag sintering to assemble a 1200 V/200 A SiC metal-oxide-semiconductor field-effect transistor power module and compared the long-term reliability, electrical properties, and driving performance of the module with those of a similar module assembled using the solder Sn-3.0Ag-0.5Cu (SAC305). To assess sinter joint reliability, we p… Show more
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