Postpolymerization of Functional Organosiloxanes: An Efficient Strategy for Preparation of Low-k Material with Enhanced Thermostability and Mechanical Properties

Abstract

A novel functional oligomer (Si-TFVE) with a siloxane backbone and thermally cross-linkable trifluorovinyl ether groups (−OCFCF 2 ) is reported here. When postpolymerized at high temperature, Si-TFVE converts to an amorphous cross-linked network (Si-PFCB), which shows a dielectric constant of 2.33 and dielectric loss below 2.1 × 10 −3 at 30 MHz. Si-PFCB also shows excellent film uniformity with the surface roughness less than 5.79 nm over a 1 μm square area. Moreover, Si-PFCB shows high thermostability with a 5 wt % loss temperature of 472 °C and no obvious T g below 350 °C. In regard to the mechanical properties, Si-PFCB has Young's modulus, hardness, and bonding strength with silicon wafer surface of 10.06 GPa, 0.392, and 4.93 GPa, respectively. These results suggest that such oligomer is suitable for utilization in ultralarge scale integration circuits. In addition, this contribution provides a new route to prepare cross-linked organosiloxanes only by heating instead of using catalysts or initiators in the traditional procedures.

Adamantyl-based benzocyclobutene low-k polymers with good physical properties and excellent planarity

“…In the last few decades, various low k materials [1][2][3][4][5][6][7][8][9] including silicates, polyimides, benzoxazine, SiLK, or benzocyclobutene have been developed, whereas commercially available low k materials with low cost are rare. The application of new low dielectric constant polymers will enable the development of future generations of lower cost and higher performance integrated circuits (ICs).…”

Enhancing the dielectric properties of highly compatible new polyimide/γ-ray irradiated MWCNT nanocomposites

“…Polymer-based composites were explored as dielectric materials to solve the problems associated with other conventional dielectrics 24,25 . Considering high mechanical strength, good solvent resistance, excellent thermal stability, and low dielectric loss, PIs gained preference over other polymeric dielectrics [36][37][38][39][40][41][42] . Among these polymers, polyvinylidene fluoride (PVDF) and its copolymers are most widely explored materials due to high dielectric constants originating from their high dipole density 1, 27,29 .…”

Propargyl ether-functionalized poly(m-phenylene): a new precursor for the preparation of polymers with high modulus and high Tg

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