2016
DOI: 10.1016/j.vlsi.2015.03.001
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Post-process die-level electromagnetic field analysis on microwave CMOS low-noise amplifier for first-pass silicon fabrication success

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Cited by 8 publications
(12 citation statements)
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“…10. (1) Worst corner performance: in red the ones that fail to meet the constraint and in green the ones that meet the constraint The optimization took approximately 10 hours in an Intel® Core i7-3770 @ 3.4GHz workstation with 32Gb of RAM, which is twice the computation effort than the previous optimization presented in Fig. 7, but the obtained POF is much more reliable.…”
Section: Enhanced Two-step Circuit Optimization: Considering Devicmentioning
confidence: 96%
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“…10. (1) Worst corner performance: in red the ones that fail to meet the constraint and in green the ones that meet the constraint The optimization took approximately 10 hours in an Intel® Core i7-3770 @ 3.4GHz workstation with 32Gb of RAM, which is twice the computation effort than the previous optimization presented in Fig. 7, but the obtained POF is much more reliable.…”
Section: Enhanced Two-step Circuit Optimization: Considering Devicmentioning
confidence: 96%
“…256 Generations 250 ƒosc (Vtune= 0 V) (1) > 2.525 GHz ƒosc (Vtune= 2.5 V) (1) < 2.475 GHz PN @ 10 kHz < -65 (dBc/Hz) PN @ 100 kHz < -92 (dBc/Hz) PN @ 1 MHz Minimize < -113 (dBc/Hz) PN @ 100 MHz < -134 (dBc/Hz) PDC Minimize < 20 mW VOUT > 0.15 V Area (µm 2 ) (2) Minimize (1) By applying these constraints we ensure that the VCO covers the target oscillation frequency of 2.5 GHz. (2) The area of each VCO is approximated as the sum of all device sizes.…”
Section: Vco Performance Vco Specifications Individualsmentioning
confidence: 99%
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