“…12 To reduce the high preparation cost associated with the high vacuum, a two-step process has been developed where the metallic components (Cu, In, Ga, Zn or Sn) are initially deposited on a conducting substrate at milder conditions followed by a sulfurization step at a high temperature. 13 A variety of techniques has been used for metallic deposition such as sputtering, 14 spray pyrolysis, 15 molecular beam deposition 16 and electrodeposition. 2 In the subsequent sulfurization process at a high temperature, H 2 S or elemental sulfur are the most used precursors despite their toxicity in the gas phase.…”