2006
DOI: 10.1007/bf03219085
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Positive-type photosensitive polyimide based on a photobase generator containing oxime-urethane groups as a photosensitive compound

Abstract: The chemical structure of a semi-aromatic polyimide-I, which was prepared by the chemical imidization of cyclopentanetetracarboxylic dianhydride and 2,2-bis(4-aminophenyl)hexafluoropropane, was characterized by 13 C-NMR spectroscopy. The chemically imidized polyimide-I was used for the preparation of a photosensitive polyimide (PSPI) through the addition of benzophenone and benzophenone oxime hexamethylene diurethane (BOHD), a photobase generator containing oxime-urethane groups. The polyimide-I film containin… Show more

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Cited by 17 publications
(6 citation statements)
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References 13 publications
(9 reference statements)
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“…It's worth mentioning that the photodecomposition reactions of PPrC, SPrC, and TKPrC were completed after 400 s irradiation, which correspond to the exposure dose of 1.80 J cm −2 . This suggests that the three photobase generators have high photosensitivity …”
Section: Resultsmentioning
confidence: 99%
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“…It's worth mentioning that the photodecomposition reactions of PPrC, SPrC, and TKPrC were completed after 400 s irradiation, which correspond to the exposure dose of 1.80 J cm −2 . This suggests that the three photobase generators have high photosensitivity …”
Section: Resultsmentioning
confidence: 99%
“…This suggests that the three photobase generators have high photosensitivity. [25][26][27][28][29][30] This result indicates that amino groups are produced upon irradiation, since fluorescamine itself is not fluorescent and only becomes fluorescent after reaction with the amino groups. Figure 4(B) shows the relative fluorescence intensities of fluorescamine treated photobase generator solutions in ethanol at 480 nm as a function of UV exposure time.…”
Section: Photochemical Properties Of the Photobase Generatorsmentioning
confidence: 99%
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“…It is found out that packing density and segmental mobility of the polymer chains are determined by blend composition and type of crosslinking agent. The concept of conventional molecular blends has been extended to PIs [8–13], keen interest being paid to the application of dielectric (insulating or packaging) layers for microelectronic devices such as very large‐scale integration and/or ultra large‐scale integration [14]. Because these applications required simultaneously high thermal stability/low relative permittivity and good adhesion, the nanomorphology control of PI molecular blends was of crucial importance to adjust these properties.…”
Section: Introductionmentioning
confidence: 99%
“…Effective methods for increasing the free volume include modification of the rigid‐rod polymer through side group attachment, and introduction of nonlinear monomers into the polymer backbone [16]. The concept of conventional molecular blends of PIs [17–22] generated keen interest for the application of dielectric layers (insulating or packaging), for microelectronic devices, such as very large‐scale integration and/or ultra‐large‐scale integration [23]. Because these applications required simultaneously high thermal stability/low relative permittivity and good adhesion, the nanomorphological control of PI molecular blends was of crucial importance to adjust these properties.…”
Section: Introductionmentioning
confidence: 99%