Porous silicon/NaOH texturization surface treatment of crystalline silicon for solar cells

Mohamed, S. Belhadj; Rabha, M. Ben; Bessaı̈s, B.

doi:10.1016/j.solener.2013.04.026

Cited by 23 publications

(5 citation statements)

References 17 publications

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“…These etchants are thoroughly investigated under various etching conditions [18,19,[22][23][24][25][26][27][28][29][30][31][32][33][34][35][36][37][38][39][40][41]. Although other kinds of alkaline solutions such as sodium hydroxide (NaOH), ethylenediamine pyrocatechol (EDP), ammonium hydroxide (NH 4 OH), cesium hydroxide (CsOH), Hydrazine, etc are used, limited number of studies have been reported [42][43][44][45][46][47][48][49][50][51][52]. Therefore, it is very important to investigate the other etchants, especially to study the effect of an additive that improves the etching rate.…”

Section: Introductionmentioning

confidence: 99%

Wet bulk micromachining characteristics of Si{110} in NaOH-based solution

Purohit¹,

Swarnalatha²,

Pandey³

et al. 2022

J. Micromech. Microeng.

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Silicon wet bulk micromachining is an extensively used technique in microelectromechanical systems (MEMS) to fabricate variety of microstructures. It utilizes low-cost etchants and suitable for batch process that made it popular for industrial production. The etch rate and the undercutting at convex corner significantly affect the productivity. In wet anisotropic etching-based micromachining, Si{110} wafer is employed to fabricate unique shape geometries such as the microstructures with vertical sidewalls. In this research, we have investigated the etching characteristics of Si{110} in 10M sodium hydroxide (NaOH) without and with addition of NH2OH. The main objective of the present work is to improve the etch rate and the undercutting at convex corners. Average surface roughness (Ra), etch depth, and undercutting length are measured using a 3D scanning laser microscope. Surface morphology of the etched Si{110} surface is examined using a scanning electron microscope (SEM). The incorporation of NH2OH significantly improves the etch rate and the corner undercutting, which are useful to enhance the productivity. Additionally, the effect of etchant age on the etch rate and other etching characteristics are investigated. The etch rate of silicon and the undercutting at convex corners decrease with etchant aging. The results presented in this paper are very useful to scientists and engineers who use silicon wet anisotropic etching to fabricate MEMS structures using bulk micromachining. Moreover, it has great potential to promote the application of wet etching in MEMS.

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Section: Introductionmentioning

confidence: 99%

Wet bulk micromachining characteristics of Si{110} in NaOH-based solution

Purohit¹,

Swarnalatha²,

Pandey³

et al. 2022

J. Micromech. Microeng.

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“…However, these traditional etching solutions only yield upright pyramid structures on monocrystalline silicon surfaces, predominantly utilized in silicon solar cells. [23][24][25] As solar cell technology progresses and efficiency demands escalate, there is a pressing need for further enhancements in solar cell efficiency. A groundbreaking advancement by M. A.…”

mentioning

confidence: 99%

“…The concept of metalassisted chemical etching originated from the use of silver ions to etch monocrystalline silicon. 25,33 This technique enables the creation of porous or silicon nanowire structures on the surface of silicon wafers. However, while the nanowire structure exhibits low reflectivity, it is unsuitable for application in solar cell production lines due to difficulties in passivating the silicon surface.…”

mentioning

confidence: 99%

Controllable Fabrication of Silicon Solar Cells with Inverted or Upright Pyramid Structures by a One-Step Copper Catalysis Method

Huo

2024

ECS J. Solid State Sci. Technol.

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Silicon has garnered significant attention as the primary material for solar cell preparation. Traditional alkaline etching solutions are limited to creating an upright pyramid structure on monocrystalline silicon surfaces. However, research indicates that an inverted pyramid structure exhibits superior light-trapping properties compared to the upright pyramid structure. In this study, we employed a one-step copper ion metal-assisted chemical etching process to fabricate an inverted pyramid structure on monocrystalline silicon wafers. This method allows for the customization of either inverted or upright pyramid structures by adjusting the concentration of specific solution components. Characterization of the textured silicon wafers reveals that the inverted pyramid structure exhibits lower reflectivity than both the upright pyramid structure and polished silicon. By integrating this texturing technique into the solar cell production line, we successfully produced solar cells with both inverted and upright pyramid structures. Evaluation of various solar cell parameters demonstrates that the inverted pyramid structure outperforms the upright pyramid structure, showcasing lower reflectivity and higher photoelectric conversion efficiency.

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“…In this study, we examined the electrochemical etching of P-type silicon wafer combined with different output laser powers. 12 The etching rate varied due to the different absorption bandgap energies of photo-electrochemistry. 13 This study discovered that when the energy of irradiant laser light is strong, the etching reaction is difficult.…”

mentioning

confidence: 99%

Utilization of Low Wavelength Laser Linking with Electrochemical Etching to Produce Nano-Scale Porous Layer on p-Type Silicon Wafer with High Luminous Flux

Immanuel

Chiang

Lee³

et al. 2021

ECS J. Solid State Sci. Technol.

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The effect of using high-power He-Cd laser irradiation for electrochemical etching on p-type silicon in hydrofluoric (HF) acid solution was investigated. Laser irradiation on the silicon surface combined with electrochemical etching process successfully controlled the formation of porous silicon (PS) in nano-scale structure. On the surface of the laser-irradiated silicon surface, the formation of nano porous silicon (NPS) during electrochemical etching was controlled by the laser wavelength and power. Then, the NPS was analysed along with physicochemical properties using analytical techniques. The luminous flux of the laser power was controlled with the help of the integrating sphere system. We designated this as the bandgap energy absorption (BEA) of electro-thermal reaction. The fabrication of NPS with laser-irradiation/electrochemical etching technology was feasible by controlling laser power (20 mW) up to a high luminescence flux value of 223 lm. NPS was used in the piratical application of microelectronic device.

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Porous silicon/NaOH texturization surface treatment of crystalline silicon for solar cells

Cited by 23 publications

References 17 publications

Wet bulk micromachining characteristics of Si{110} in NaOH-based solution

Wet bulk micromachining characteristics of Si{110} in NaOH-based solution

Controllable Fabrication of Silicon Solar Cells with Inverted or Upright Pyramid Structures by a One-Step Copper Catalysis Method

Utilization of Low Wavelength Laser Linking with Electrochemical Etching to Produce Nano-Scale Porous Layer on p-Type Silicon Wafer with High Luminous Flux

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