2021
DOI: 10.3390/app112311104
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Porous Electrodeposited Cu as a Potential Electrode for Electrochemical Reduction Reactions of CO2

Abstract: In the present study, a systematic investigation is performed to assess the relationship between electroplating parameters, pore morphology and internal surface area of copper deposits which are promising to serve as electrodes for electrochemical reduction reactions of carbon dioxide (CO2). A set of porous copper deposits are fabricated with the dynamic hydrogen bubble template method. The microstructural and Brunauer–Emmett–Teller (BET) analysis demonstrate that current density, deposition time, and bath com… Show more

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Cited by 8 publications
(9 citation statements)
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References 38 publications
(57 reference statements)
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“…For copper foams deposited from acidic electrolytes with a Cl − additive, roughness factors of ~ 400 Specific surface areas of the copper foams amount to 3.4 and 5.9 m 2 •g −1 for Cu f and Cu f,Cl samples with 10 s deposition time and do not depend significantly on the foam thickness. The specific surface area values are close to the specific surface areas obtained for similar copper foams using the BET method (~4 m 2 •g −1 ) [49]. This demonstrates that under the chosen experimental conditions, diffusion limitations in the pores of the copper deposits are efficiently minimized, and the whole surface area is accessible for the UPD process, which is an indication of the reliability of the RSA estimates derived from the Pb UPD measurements.…”
Section: Discussionsupporting
confidence: 80%
“…For copper foams deposited from acidic electrolytes with a Cl − additive, roughness factors of ~ 400 Specific surface areas of the copper foams amount to 3.4 and 5.9 m 2 •g −1 for Cu f and Cu f,Cl samples with 10 s deposition time and do not depend significantly on the foam thickness. The specific surface area values are close to the specific surface areas obtained for similar copper foams using the BET method (~4 m 2 •g −1 ) [49]. This demonstrates that under the chosen experimental conditions, diffusion limitations in the pores of the copper deposits are efficiently minimized, and the whole surface area is accessible for the UPD process, which is an indication of the reliability of the RSA estimates derived from the Pb UPD measurements.…”
Section: Discussionsupporting
confidence: 80%
“…19,24 However, challenges persist when using Cu in the form of foils or large nanoparticles, as over 95% of the atoms are located below the surface and remain unutilised in the reaction. 25,26 This underscores the urgent need to advance the field of CO2 reduction towards single metal atoms and sub-5 nm nanoparticles to maximise atom utilization efficiency and enhance selectivity control through the well-defined nature of catalytically active sites.…”
Section: Introductionmentioning
confidence: 99%
“…2,3 An efficient, fast and solvent-free electrochemical deposition method to produce highly porous 3D structured foam electrodes is the dynamic hydrogen bubble templation (DHBT). [4][5][6] This technique takes advantage of the parasitic hydrogen evolution reaction (HER) by which metal foam electrodes can be produced within seconds in a very controlled fashion. Metal ions are reduced and electrochemically deposited by applying sufficiently high overpotentials, while simultaneously the hydrogen bubbles originating from the HER detach from the substrate and work as a negative template for the formation of macro-porous layers and nanoscale interconnecting foam walls.…”
Section: Introductionmentioning
confidence: 99%
“…[7][8][9][10] Most of the electrodes fabricated by DHBT are tested in H-cell configurations and evaluated for CO 2 RR in aqueous electrolyte, saturated with CO 2 . [4][5][6][11][12][13][14][15][16][17][18][19] Here, the successful design of the DHBT foam electrodes and its effects on the CO 2 RR performance can be studied very effectively. A significant drawback in aqueous-fed systems is the limited CO 2 solubility, resulting in long diffusion pathways of CO 2 within the bulk electrolyte.…”
Section: Introductionmentioning
confidence: 99%