Polysilsesquioxane-PBO Wave-Transparent Composite Paper with Excellent Mechanical Properties and Ultraviolet Aging Resistance

Lin, Yuhan; Fan, Xiaoli; Tang, Lin; Tang, Yusheng; Gu, Junwei

doi:10.1007/s42765-023-00327-y

Cited by 13 publications

(7 citation statements)

References 53 publications

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“…The immense potential of POSS-containing nanocomposites unlocks boundless possibilities for designing and manufacturing high-performance integrated circuits in the next generation. FPHE-POSS6%/CE 2.39 (9 GHz) 0.0027 (9 GHz) [192] POSS-TFVE 2.51 (5 GHz) 0.0031 (5 GHz) [216] DDSQ-3e 2.85 (28 GHz) 0.0072 (28 GHz) [220] POSS-PNF-20/80 2.12 (10 GHz) 0.038 (10 GHz) [232] sPS−6 vol%-HS 1.95 (5 GHz) 0.0001 (5 GHz) [240] GOPOSS-4 wt%-sPS 1.85 (5 GHz) 0.02 (5 GHz) [239] Li Miao is a master's student at the Hangzhou Normal University. His research interest focus is on organic silicon functional materials.…”

Section: Discussionmentioning

confidence: 99%

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The Recent Advances of Polymer–POSS Nanocomposites With Low Dielectric Constant

Miao,

Zhan,

Liao

et al. 2024

Macromol. Rapid Commun.

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This study provides a comprehensive overview of the preparation methods for polyhedral oligomeric silsesquioxane (POSS) monomers and polymer/POSS nanocomposites. It focuses on the latest advancements in using POSS to design polymer nanocomposites with reduced dielectric constants. The study emphasizes exploring the potential of POSS, either alone or in combination with other materials, to decrease the dielectric constant and dielectric loss of various polymers, including polyimides, bismaleimide resins, poly(aryl ether)s, polybenzoxazines, benzocyclobutene resins, polyolefins, cyanate ester resins, epoxy resins, and more. Additionally, the research investigates the impact of incorporating POSS on improving the thermal properties, mechanical properties, surface properties, and other aspects of these polymers. The entire study is divided into two parts, discussing systematically the role of POSS in reducing dielectric constants during the preparation of POSS composites using both physical blending and chemical synthesis methods. The goal of this research is to provide valuable strategies for designing a new generation of low dielectric constant materials suitable for large‐scale integrated circuits in the semiconductor materials domain.This article is protected by copyright. All rights reserved

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Section: Discussionmentioning

confidence: 99%

“…In this study, an "adsorption filtration and hot-pressing" method was employed to prepare PNF and polymer-crosslinked siloxane (POSS) composite paper, as shown in Figure 17e. [232] Hydrogen bonds between NH 2 -POSS Figure 16. A diagram showing the deformation processes during imidization.…”

Section: Physical Blending Methodsmentioning

confidence: 99%

The Recent Advances of Polymer–POSS Nanocomposites With Low Dielectric Constant

Miao,

Zhan,

Liao

et al. 2024

Macromol. Rapid Commun.

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“…In contrast, the α value of epoxy resins is a microscopic physical quantity reflecting the polarization characteristics of molecular structures of epoxy resins. The Clausius–Mossotti equation Equation (1) reflects the relationship between the macroscopic dielectric parameter ( ε ) and the microscopic molecular polarizability ( α ) of epoxy‐cured resins 18

$$ \frac{\varepsilon -1}{\varepsilon +2}\times \frac{M}{\rho }=\frac{N_{\mathrm{A}}}{3{\epsilon}_0}\times \alpha .

…”

Section: Main Factors Affecting the Dielectric Properties Of Epoxy Re...mentioning

confidence: 99%

A mini‐review of ultra‐low dielectric constant intrinsic epoxy resins: Mechanism, preparation and application

Wu,

Fan,

Wang

et al. 2023

Polymers for Advanced Techs

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Epoxy resins are widely utilized in electronics, electrical components, and communication equipment for polymer‐based wave‐transparent composites. However, the dielectric constant (ε) and dielectric loss (tanδ) of common epoxy resins are relatively high (ε for 3.8–4.2; tanδ for 0.018–0.025), and the corresponding impact resistance is poor. Thus, it cannot meet the requirements of advanced microelectronic materials. And the epoxy resins prepared by filling the inorganic fillers are difficult to combine the low ε with good machining performance. The ε and tanδ of intrinsic epoxy resins can be decreased by the synthesis of epoxy monomers and curing agents and the optimization of the final curing network. Meanwhile, the use of some special processing methods, such as the electrospinning technology, is also conducive to reducing the ε and tanδ values of final epoxy‐cured resins. The factors affecting the dielectric properties of epoxy‐cured resins, and the common methods to decrease the ε value of epoxy‐cured resins are reviewed in this article. Then, the design, synthesis and research progress of ultra‐low ε epoxy resins are investigated with the relevant academic results. Finally, the development trends and application prospects of the ultra‐low ε epoxy resins are discussed.

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“…For instance, the strength retention of PBO and aramid fibers shows a rapid decrease trend under high temperature, and the manufacturing of these fibers is complex, requiring exceptionally advanced processing equipment. Additionally, PBO fibers exhibit poor resistance to ultraviolet (UV) light or other irradiation environments. − Aramid fibers are also susceptible to degradation when exposed to UV light, which makes them unsuitable for prolonged outdoor use. Inorganic fibers such as glass fibers are characterized by high brittleness and inadequate wear resistance, significantly restricting their potential applications.…”

Section: Introductionmentioning

confidence: 99%

Preparation of High-Temperature Resistant Polyimide Fibers by Introducing the p-Phenylenediamine into Kapton-Type Polyimide

Dong,

et al. 2024

ACS Appl. Polym. Mater.

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To improve the heat resistance of polyimide (PI) fibers for application in harsh environments and establish a correlation among the chemical structure, fabrication performance, and material properties, a simple and rigid diamine, p-phenylenediamine (p-PDA) was incorporated into the Kapton-type PI synthesized from pyromellitic dianhydride and 4,4-diaminodiphenylmethane (ODA). The comprehensive properties of these co-PI fibers were systematically investigated to assess the impact of p-PDA addition. Two-dimensional wide-angle X-ray diffraction (WAXD) was used to investigate the evolution of the aggregation structure of the co-PI fibers during the processing. The thermogravimetric analyzer (TGA) test shows that the incorporation of p-PDA improves the heat resistance of polyimide fibers, with the 10 wt % weight loss temperature (T 10% ) ranging from 582 to 605 °C and the maximum decomposition temperature (T max ) of 611−635 °C for the co-PI fibers with different p-PDA contents. Additionally, the potential degradation mechanism of the PI fibers was examined by utilizing pyrolysis-gas chromatography/mass spectrometry (Py-GC/MS) and other thermal analyses. By introducing p-PDA, the content of O element (ether bond in ODA) in the system decreases, leading to a reduction in oxygen free radicals from ODA during the decomposition process of polyimides. The decrease in active species can cause a decrease in the decomposition rate and improve the heat resistance of the polyimide fibers. The study of the thermal decomposition mechanism of polyimides provides a valuable foundation for the preparation of high-performance polymer fibers with enhanced thermal resistance and excellent overall performance.

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Polysilsesquioxane-PBO Wave-Transparent Composite Paper with Excellent Mechanical Properties and Ultraviolet Aging Resistance

Cited by 13 publications

References 53 publications

The Recent Advances of Polymer–POSS Nanocomposites With Low Dielectric Constant

The Recent Advances of Polymer–POSS Nanocomposites With Low Dielectric Constant

A mini‐review of ultra‐low dielectric constant intrinsic epoxy resins: Mechanism, preparation and application

Preparation of High-Temperature Resistant Polyimide Fibers by Introducing the p-Phenylenediamine into Kapton-Type Polyimide

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