2014
DOI: 10.1007/s00542-014-2318-1
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Polysilicon thin film piezoresistive pressure microsensor: design, fabrication and characterization

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Cited by 50 publications
(13 citation statements)
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“…After the first monolithic capacitive pressure sensor was designed for medical-research applications in 1980 [13], silicon solution tablets technology and etch-stop technique were put forward to make the capacitive sensor [14]. Afterwards, the CPS with different microstructures had been deeply studied due to the introduction of MEMS (microelectromechanical systems) technology [15][16][17][18]. Ji et al [19] made the capacitive pressure sensor by a combination of a standard CMOS (Complementary Metal Oxide Semiconductors) process and bulk micromachining technology.…”
Section: Introductionmentioning
confidence: 99%
“…After the first monolithic capacitive pressure sensor was designed for medical-research applications in 1980 [13], silicon solution tablets technology and etch-stop technique were put forward to make the capacitive sensor [14]. Afterwards, the CPS with different microstructures had been deeply studied due to the introduction of MEMS (microelectromechanical systems) technology [15][16][17][18]. Ji et al [19] made the capacitive pressure sensor by a combination of a standard CMOS (Complementary Metal Oxide Semiconductors) process and bulk micromachining technology.…”
Section: Introductionmentioning
confidence: 99%
“…Using analytical equations for analysis can lead to limiting the accuracy because of difference in clamping conditions of a plate and an actual diaphragm [7]. Also, it is difficult to obtain the analytical solutions in case of complex structures like bossed diaphragms.…”
Section: Theorymentioning
confidence: 99%
“…Although a single resistor can also perform the function of determining the pressure input based on change in resistance (Chung et al 1991;Motorola 1998), usually, four piezoresistors (connected in Wheatstone bridge configuration) are used for this purpose. Using a Wheatstone bridge helps in cancelling out the temperature effects due to TCR (Kumar and Pant 2014b). Different materials have been reported to exhibit the property of piezoresistance, such as silicon (Zhang et al 2007;Bian et al 2009), polysilicon (Tsai et al 2009;Malhaire and Barbier 2003), silicon carbide (Fraga et al 2010;Wu et al 2006), carbon fibre (Park et al 2007), diamond (Werner et al 1998;Wur et al 1995) etc.…”
Section: Introductionmentioning
confidence: 96%