Polyols as Phase Change Materials for Low-grade Excess Heat Storage

Gunasekara, Saman Nimali; Pan, Ruijun; Chiu, Justin; Martin, Viktoria

doi:10.1016/j.egypro.2014.11.938

Cited by 11 publications

(6 citation statements)

References 35 publications

(34 reference statements)

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“…Comparing the thermal conductivity from the requirements with the values of the sugar alcohol from the literature [22] (λ ≈ 0.73 W m −1 K −1 , decreasing with higher temperature), it is conspicuous that this property has to be improved by additional filler materials with a better thermal conductivity.…”

Section: Property Value Unitmentioning

confidence: 95%

Thermal peak management using organic phase change materials for latent heat storage in electronic applications

Maxa¹,

Novikov²,

Nowottnick³

2017

2017 21st European Microelectronics and Packaging Conference (EMPC) &Amp; Exhibition

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Modern high power electronics devices consists of a large amount of integrated circuits for switching and supply applications. Beside the benefits, the technology exhibits the problem of an ever increasing power density. Nowadays, heat sinks that are directly mounted on a device, are used to reduce the on-chip temperature and dissipate the thermal energy to the environment. This paper presents a concept of a composite coating for electronic components on printed circuit boards or electronic assemblies that is able to buffer a certain amount of thermal energy, dissipated from a device. The idea is to suppress temperature peaks in electronic components during load peaks or electronic shorts, which otherwise could damage or destroy the device, by using a phase change material to buffer the thermal energy. The phase change material coating could be directly applied on the chip package or the PCB using different mechanical retaining jigs.

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Section: Property Value Unitmentioning

confidence: 95%

Thermal peak management using organic phase change materials for latent heat storage in electronic applications

Maxa¹,

Novikov²,

Nowottnick³

2017

2017 21st European Microelectronics and Packaging Conference (EMPC) &Amp; Exhibition

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“…Health hazard (NFPA) Acetanilide 2 [22] Meso-erythritol 1 [23] In-48Sn 2 [24] densities in Table 7. In-48Sn is shown to have the highest cost per unit volume which is about forty times the cost of acetanilide and about one hundred times the cost of mesoerythritol per unit volume.…”

Section: Pcmmentioning

confidence: 99%

“…Erythritol has also been identified by several studies as a PCM for latent heat thermal energy storage systems for temperature applications between 110 and 120°C [24][25][26][27][28][29]. Sharma et al [10] utilized erythritol as a heat storage material in a heat storage unit designed for cooking application.…”

Section: Introductionmentioning

confidence: 99%

Rapid thermal cycling of three phase change materials (PCMs) for cooking applications

Shobo

Mawire

Aucamp

2018

J Braz. Soc. Mech. Sci. Eng.

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The suitability of the use of acetanilide, meso-erythritol and In-48Sn as phase change materials (PCMs) in latent heat thermal storage systems (LHTES) for cooking applications has been investigated under high charging and heat retrieval conditions. In-48Sn showed the greatest thermal stability up to 289.68°C with meso-erythritol showing stability up to 177.03°C, while acetanilide is thermally stable up to 133.33°C. Thermal properties of acetanilide remained within stable limits with rapid thermal cycles, but rapid mass degradation was observed. Two forms of meso-erythritol were manifested with different melting points with the solidification temperature that showed considerable variations while the enthalpy of solidification remained reasonably stable. Acetanilide and meso-erythritol exhibited large degrees of supercooling below 100°C making them undesirable to be used in a LHTES unit for cooking applications under rapid heating and cooling cycles. With the solidification temperature of In-48Sn above 100°C throughout the thermal cycles, it proved to be a promising PCM for cooking applications under rapid heating and cooling cycles. The residues of the PCMs after thermal cycling showed no structural changes as compared with the fresh samples while the health hazards related to the PCMs were all within acceptable limits. Though the cost implication of utilizing In-48Sn is much higher as compared with the other two PCMs, its good cycling stability and its average solidification temperature being within desired cooking temperature makes it a preferred PCM candidate under fast heat retrieval condition than acetanilide and meso-erythritol. Keywords Phase change materials (PCM) Á Thermal stability Á Cycling stability Á Acetanilide Á Meso-erythritol Á In-48Sn

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“…Comparing the thermal conductivity from the requirements with the values of the sugar alcohol from the literature [ 22 ] (

, decreasing with higher temperature), it is conspicuous that this property has to be improved by additional filler materials with a better thermal conductivity.…”

Section: Cooling Conceptmentioning

confidence: 99%

Thermal Peak Management Using Organic Phase Change Materials for Latent Heat Storage in Electronic Applications

2017

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Polyols as Phase Change Materials for Low-grade Excess Heat Storage

Cited by 11 publications

References 35 publications

Thermal peak management using organic phase change materials for latent heat storage in electronic applications

Thermal peak management using organic phase change materials for latent heat storage in electronic applications

Rapid thermal cycling of three phase change materials (PCMs) for cooking applications

Thermal Peak Management Using Organic Phase Change Materials for Latent Heat Storage in Electronic Applications

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