Polyol-based phase-change thermal interface materials

Aoyagi, Yasuhiro; Leong, Chia-Ken; Chung, D.D.L.

doi:10.1007/bf02690528

Cited by 18 publications

(7 citation statements)

References 26 publications

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“…are often used as PCMs. However, in the absence of appropriate additives, their thermal stability is poor, 10 because of their small molecular size and low dissociation energy.…”

Section: Methodsmentioning

confidence: 99%

“…The extent of undercooling depends on the phase-change matrix and the solid component. 10 The conformability strongly affects the effectiveness as a TIM, but it is an attribute that is difficult to measure. The ability to withstand elevated temperatures can be enhanced significantly by the addition of antioxidants to polyol esters.…”

Section: Introductionmentioning

confidence: 99%

“…Another novel organic phase-change matrix is polyol. 10 The matrix materials in commercially available PCMs are mostly proprietary. Comparative evaluation of various organic PCMs, including commercial ones, is included in this work.…”

Section: Introductionmentioning

confidence: 99%

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Antioxidant-Based Phase-Change Thermal Interface Materials with High Thermal Stability

Aoyagi

Chung

2008

Journal of Elec Materi

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This work provides phase-change thermal interface materials (TIMs) with high thermal stability and high heat of fusion. They are based on antioxidants mainly in the form of hydrocarbons with linear segments. The thermal stability is superior to paraffin wax and four commercial phase-change materials (PCMs). The use of 98.0 wt.% thiopropionate antioxidant (SUMILIZER TP-D) with 2.0 wt.% sterically half-hindered phenolic antioxidant (GA80) as the matrix and the use of 16 vol.% boron nitride particles as the solid component give a PCM with a 100°C lifetime indicator of 5.3 years, in contrast to 0.95 year or less for the commercial PCMs. The heat of fusion is much higher than those of commercial PCMs; the values for antioxidants with nonbranched molecular structures exceed that of wax; the value for one with a branched structure is slightly below that of wax. The phase-change properties are degraded by heating at 150°C much less than those of the commercial PCMs. The stability of the heat of fusion upon phase-change cycling is also superior. The viscosity is essentially unaffected by heating at 150°C. Commercial PCMs give slightly lower values of the thermal contact conductance for the case of rough (12 lm) mating surfaces, in spite of the lower values of the bond-line thickness.

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“…are often used as PCMs. However, in the absence of appropriate additives, their thermal stability is poor, 10 because of their small molecular size and low dissociation energy.…”

Section: Methodsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Antioxidant-Based Phase-Change Thermal Interface Materials with High Thermal Stability

Aoyagi

Chung

2008

Journal of Elec Materi

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“…The performance of TIMs depends on both thermal conductivity and contact resistance [ 4 ]. Because their good wettability and low modulus of elasticity can increase the contact area and reduce the contact resistance, thermal greases are widely used, alongside traditional phase change materials (PCMs), which can become liquid and fill gaps and voids at high temperatures [ 19 , 20 , 21 ]. However, thermal greases are limited by the problems of pump-out and dry-out [ 22 ], while solid–liquid PCMs have the disadvantages of leakage and extra encapsulations [ 23 ].…”

Section: Introductionmentioning

confidence: 99%

RGO-Coated Polyurethane Foam/Segmented Polyurethane Composites as Solid–Solid Phase Change Thermal Interface Material

Zhang

Shi

et al. 2020

Polymers

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Thermal interface material (TIM) is crucial for heat transfer from a heat source to a heat sink. A high-performance thermal interface material with solid–solid phase change properties was prepared to improve both thermal conductivity and interfacial wettability by using reduced graphene oxide (rGO)-coated polyurethane (PU) foam as a filler, and segmented polyurethane (SPU) as a matrix. The rGO-coated foam (rGOF) was fabricated by a self-assembling method and the SPU was synthesized by an in situ polymerization method. The pure SPU and rGOF/SPU composite exhibited obvious solid–solid phase change properties with proper phase change temperature, high latent heat, good wettability, and no leakage. It was found that the SPU had better heat transfer performance than the PU without phase change properties in a practical application as a TIM, while the thermal conductivity of the rGOF/SPU composite was 63% higher than that of the pure SPU at an ultra-low rGO content of 0.8 wt.%, showing great potential for thermal management.

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“…Liu and Chung used scanning calorimetry to evaluate PCMs for use as TIMs [7]. Aoyagi et al [8] evaluated the polyol-based PCMs, which have thermal contact conductance higher than those of paraffin wax, polyether glycol, etc. Its thermal stability is superior to other PCMs [8].…”

Section: Introductionmentioning

confidence: 99%

Investigation of thermal interface materials using phase-sensitive transient thermoreflectance technique

Feng

King

DeVoto

et al. 2014

Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

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With increasing power density in electronics packages/modules, thermal resistances at multiple interfaces are a bottleneck to efficient heat removal from the package. In this work, the performance of thermal interface materials such as grease, thermoplastic adhesives and diffusion-bonded interfaces are characterized using the phase-sensitive transient thermoreflectance technique. A multi-layer heat conduction model was constructed and theoretical solutions were derived to obtain the relation between phase lag and the thermal/physical properties. This technique enables simultaneous extraction of the contact resistance and bulk thermal conductivity of the TIMs. With the measurements, the bulk thermal conductivity of Dow TC-5022 thermal grease (70 to 75 μm bondline thickness) was 3 to 5 W/(m•K) and the contact resistance was 5 to 10 mm 2 •K/W. For the Btech thermoplastic material (45 to 80 μm bondline thickness), the bulk thermal conductivity was 20 to 50 W/(m•K) and the contact resistance was 2 to 5 mm 2 •K/W. Measurements were also conducted to quantify the thermal performance of diffusion-bonded interface for power electronics applications. Results with the diffusion-bonded sample showed that the interfacial thermal resistance is more than one order of magnitude lower than those of traditional TIMs, suggesting potential pathways to efficient thermal management.

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Polyol-based phase-change thermal interface materials

Cited by 18 publications

References 26 publications

Antioxidant-Based Phase-Change Thermal Interface Materials with High Thermal Stability

Antioxidant-Based Phase-Change Thermal Interface Materials with High Thermal Stability

RGO-Coated Polyurethane Foam/Segmented Polyurethane Composites as Solid–Solid Phase Change Thermal Interface Material

Investigation of thermal interface materials using phase-sensitive transient thermoreflectance technique

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