Polymerization of 4‐chloroformylphthalic anhydride with 4,4′‐diaminodiphenylether

Alvino, William M.

doi:10.1002/app.1975.070190303

Cited by 24 publications

(10 citation statements)

References 5 publications

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“…Poly(amide-imide) is synthesized by the solution polycondensation of DADPM with 4-chloroformylphthalic anhydride via poly(amide-amic acid) [6], as shown in eq 1, or the solution polycondensation of MDI with TMA [5,7], as shown in eq 2. The insulation layer for enameled wire was thus prepared from poly(amide-imide) varnish by solution polycondensation of MDI with TMA, without generating hydrogen chloride, which causes enameled wire to deteriorate.…”

Section: Resultsmentioning

confidence: 99%

Preparation of Poly(amide-imide)-silica Hybrid Materials by Sol-gel Process

Morikawa

Suzuki

Asano

2016

J. Photopol. Sci. Technol.

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Poly(amide-imide)-silica hybrid films were prepared using the sol-gel process of tetraethoxysilane (TEOS). A dianhydride-terminated poly(amide-imide) oligomer was prepared by the reaction of 4,4`-diphenylmethanediisocyanate (MDI) and trimellitic andydride (TMA) (MDI:TMA = 2:3 equivalents) in N-methylpyrrolidone (NMP) at 120 °C. One equivalent of 4,4′-diaminodiphenylmethane (DADPM) was added to the oligomer solution at room temperature to form the poly(amide-imide) precursor having carboxylic acid groups.The hydrolysis-polycondensation of TEOS could be carried out in the solution, and the poly(amide-imide)-silica hybrid film was obtained by casting the homogeneous silica-containing solution onto a glass plate, followed by heating at 300 °C. The silica content was 33 wt%, and silica particles with diameter of about 2 μm were observed in the hybrid films by scanning electron microscopy (SEM). Keywords:sol-gel process, poly(amide-imide)-silica hybrid, 4,4`-diphenylmethanediisocyanate, trimellitic andydride, 4,4′-diaminodiphenylmethane, tetraethoxysilane IntroductionThe sol-gel process is a method for preparation of inorganic metal oxides starting from organic metal alkoxides.The reaction consists of hydrolysis of the metal alkoxides, followed by polycondensation of the hydrolyzed intermediates. The sol-gel process has been applied in a polymer matrix to prepare inorganic and organic hybrid materials [1]. Polyimide-silica hybrid films have been successfully prepared by the sol-gel reaction of TEOS in polyamic acid solution, with subsequent heating of the resulting film at 270 °C. The hybrid film exhibited a higher modulus, lower coefficient of thermal expansion, and higher10 wt% loss temperature than non-hybrid films [2].We produced enameled wire having a polyimide-silica hybrid insulation layer prepared by the sol-gel process of TEOS [3,4]. TEOS was hydrolyzed and then polycondensed in a Kapton-type polyamic acid varnish, which is NMP solution, and the conductor was coated with the

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Section: Resultsmentioning

confidence: 99%

Preparation of Poly(amide-imide)-silica Hybrid Materials by Sol-gel Process

Morikawa

Suzuki

Asano

2016

J. Photopol. Sci. Technol.

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“…On the other hand, through the reaction of trimellitic anhydride chloride (TMAC) with diamines at low temperature, hydrochloric acid (HCl) molecules as a by-product of amidization reaction with higher enthalpy of formation are produced. It also reduces the physical and mechanical properties of the product, resulting in degradation of polymer chains [4,5].…”

Section: Introductionmentioning

confidence: 99%

Synthesis and Characterization of a New Semi-Aliphatic Poly(amide-imide) and Evaluation of the Effect of Reaction Conditions

Afsharian-Moghadam

Haddadi‐Asl

2008

Designed Monomers and Polymers

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Synthesis and characterization of a new aliphatic-aromatic poly(amide-imide) (PAI) with regular microstructure obtained via a two-step polymerization method was investigated. Firstly a fully imidized diimide-diacid (DIDA) intermediate was synthesized from trimellitic anhydride acid (TMA) and an aliphatic diamine with the ratio of 2:1; then, the corresponding PAI was prepared via a polycondensation reaction of the DIDA and an aromatic diisocyanate. Aprotic polar solvents like N-methyl pyrolidone (NMP) were used as the reaction solvent. Moreover, it was investigated how the regime of diamine addition affects the DIDA microstructure and the reaction yield. The effects of monomer ratio and its molecular structure, which determine the aliphatic/aromatic content of polymer backbone, on the structure and properties of the synthesized PAI were investigated. In addition, the effect of reaction solvent on polymer molecular weight through measurement of intrinsic viscosity was also studied. Fourier transform infrared (FT-IR) spectroscopy was used to determine the best reaction condition for DIDA synthesis, and nuclear magnetic resonance spectroscopy ( 1 H-and 13 C-NMR) was used to characterize the microstructure of synthesized polymers. Thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC) techniques were also used to characterize and study the polymer properties. As a result, it was shown that in the first step of the reaction merely a DIDA intermediate structure was synthesized without any side-reaction and subsequently a highly ordered co-polymer with amide-amide-imide-imide sequence was produced.  Koninklijke Brill NV, Leiden, 2008

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“…Recently, we have reported reasonable methods to reduce melt viscosity for easy processing by lessening chainchain interactions between polymer chains at melt stage by incorporating aliphatic diamines such as isophorone diamine and a diamine containing a cyclohexylene unit 7,8) . It has been well known that PAIs can be prepared by polycondensation of trimellitic anhydride (TMA) and aromatic diisocyanates 9) , trimellitic anhydride chloride (TMAC) or diimide diacid chlorides (DIDCs) and aromatic diamines 10) , and direct polycondensation of TMA or diimide diacids (DIDAs) and aromatic diamines 11,12) or diimide diamines (DIDAs). The PAIs produced from TMA with aromatic diisocyanates are very useful for magnetic wire insulation 13) .…”

Section: Introductionmentioning

confidence: 99%

“…A number of methods, including incorporation of flexible or non-symmetrical linkages in the polymer backbone or using a monomer with bulky substituents have been used to improve their solubility and processabilty. Various modified copolyimides such as polyetherimide (PEI), poly(amide imide) (PAI) etc., have also been proposed and developed [2][3][4] . PAIs are generally amorphous and injection-moldable thermoplastics that exhibit outstanding mechanical properties at high temperature with good dimensional stability, excellent creep, impact and chemical resistance 5,6) .…”

Section: Introductionmentioning

confidence: 99%