Polymeric Materials for Electronics Packaging and Interconnection

Abstract

An overview of the driving forces for the increased importance of packaging and interconnection to progress in electronics is presented, with emphasis on the influence and importance of the role of polymers. Relevant information on market values for components is included, where appropriate. In addition, trends in interconnection and packaging, their combined role, and their market size are discussed.Examples are given in which plastic packaging can lead to substantial reductions in packaged IC cost. An extensive overview of polymer applications is presented, with special emphasis on thin films, protective gels, rigid encapsulants, and printed wiring board materials and processes. The chapter also indicates why the symposium and the book are timely and important, especially for those interested in the chemical aspects of these materials.From a number of standpoints, progress in electronics is becoming critically dependent on electronic packaging and interconnection. The ability to achieve fast clock rates, sufficient heat dissipation, uniform and appropriate electrical impedance, and high reliability and performance of packages, to name a few, are key requirements for which interconnection and packaging play increasingly important roles.In fact, it is projected that by 1995 the value added by packaging and interconnection will exceed that of the integrated circuit chips themselves in many more applications than occurs even today (1).Although a number of organizations and symposia have dealt with packaging, and to some extent with polymers, virtually none have emphasized the synthetic and physical chemistry aspects of these systems.For those reasons, we felt it was especially

Kinetic and mechanistic investigations of the formation of polyimides under homogeneous conditions

“…Ultra-high-purity 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA) was purchased as a white crystalline solid from Allco Chemical Co. and used after vacuum drying at 130 "C for at least 12 h. Phthalic anhydride (PA) and tert-butylphthalic anhydride (t-BuPA) purchased from Aldrich were purified by sublimation. High-purity4,4'-oxydianiline (4,4'-ODA) purchased from Chriskev Co. was used as received. The 4,4'-diaminodiphenyl sulfone (4,4'-DDS) was obtained from Chriskev Co. and was recrystallized from deoxygenated methanol.…”

High-g impact resistance for epoxy molding compound

“…Plastic packaging materials should posses a good combination of physical, mechanical, thermal and electrical properties [11] . It was used on about 90% of the semiconductor packages produced worldwide because of its low cost, ease of processing as well as excellent electrical properties [11,12] .…”

Ultrasound aided smooth dispensing for high viscoelastic epoxy in microelectronic packaging

“…The dispensed underfilling material protects neighboring interconnections from short-circuiting and releases residual stress [1]. The most widely used underfilling material is epoxy as it is an excellent electrical insulator and highly stable [2][3][4]. Typically, the required amount of epoxy is usually on the nanoliter scale with a high degree of consistency (>95%) [5][6][7][8].…”