Polymer Optical Interconnects&amp;#8212;A Scalable Large-Area Panel Processing Approach

Uhlig, Steffen; Fröhlich, L.; Chen, M.; Arndt-Staufenbiel, Norbert; Lang, G.; Schröder, Henning; Houbertz, R.; Popall, Michael; Robertsson, Mats

doi:10.1109/tadvp.2005.849555

Cited by 36 publications

(21 citation statements)

References 38 publications

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“…Furthermore, similar effects were discovered with another refractive index tuning agent, ORMOCLAD (henceforth referred to as OC-II), 4 together with OC-I, where experiments were conducted analogously. Although the dewetting effect was revealed on the system OC-I:OC-III, the report's focus is on the system OC-I:OC-II, because these materials are commercially available, and OC-III is still in a research state.…”

Section: Introductionmentioning

confidence: 58%

“…The synthesis of OC-I from silane precursors diphenylsilanediol and 3-methacryloxypropyltrimethoxysilane 5 by modified 4 Commercially available, Microresist Technology, Berlin, Germany 5 Trimethoxysilanes are composed of one silicon atom in the center surrounded by four oxygen atoms. Three of them are connected to a methyl group (0CH ), whereas the fourth is connected to other functional groups as indicated by the names of the base chemicals given in the text.…”

Section: B Synthesis Of Materialsmentioning

confidence: 99%

“…Previously, we reported on a large-area panel (LAP) optical backplane approach [4], including SBU-processing, using inorganic-organic hybrid materials (ORMOCERs) 1 [5]. For optical backplane applications, a waveguide structure, composed of two cladding layers and a waveguide core layer in between had to be fabricated.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Preventing of Dewetting Effects for Inorganic-Organic Hybrid Polymers Applied in Sequentially Buildup (SBU) Technology Without Surface Pretreatments

Uhlig

Domann

Houbertz

et al. 2006

IEEE Trans. Electron. Packag. Manufact.

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Upon processing waveguide structures by using the ORMOCER materials ORMOCORE as core material, and a mixture of ORMOCORE and ORMOCER-III (refractive index tuning agent) as cladding material, dewetting effects of the core layer from the cladding layer were observed. A similar phenomenon was observed for a mixture of ORMOCORE and ORMOCLAD which was used as comparative refractive index tuning material. In order to use these material combinations for large-area panel (LAP) processing, a pretreatment or activation of surfaces is necessary but hard to realize. However, the addition of small amounts of ORMOCER-III or ORMOCLAD, respectively, to the core layer material, prevented the dewetting phenomenon. The objective of this, however, is to minimize the content of refractive index tuning agent in the core layer by retaining a good wetting behavior during multilayer processing. Wet film stability tests and contact angle measurements of these ORMOCER systems in various compositions on another ORMOCER surface of a specific cladding material composition were performed on a hotplate. Furthermore, contact angles of droplets formed by deionized water, formamide, and di-iodomethane on cured surfaces of these ORMOCER systems in a wide range of compositions were characterized, and surface tensions were calculated. By adding 0.1 wt% of ORMOCER-III or 5 wt% ORMOCLAD, respectively, to the pure ORMOCORE solution, the dewetting phenomenon was eliminated, while simultaneously the refractive index was affected only to a minor degree and no changes in the optical loss could be detected. It was shown that by adding ORMOCER-III or ORMOCLAD to pure ORMOCORE, the surface tension of the compound system was reduced. In comparison to silanization or gasplasma treatment to overcome dewetting effects in microelectronics multilayer processing, the investigated mixing method eliminates process steps and thus costs, and opens new process routes for LAP processing.Index Terms-Alternative process route, contact angle measurement, dewetting, heterogeneous multilayer structure, large-area panel processing, ORMOCER, sequentially buildup unit (SBU), surface tension.

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Section: Introductionmentioning

confidence: 58%

Section: B Synthesis Of Materialsmentioning

confidence: 99%

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Preventing of Dewetting Effects for Inorganic-Organic Hybrid Polymers Applied in Sequentially Buildup (SBU) Technology Without Surface Pretreatments

Uhlig

Domann

Houbertz

et al. 2006

IEEE Trans. Electron. Packag. Manufact.

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“…The waveguides are always multimodal step index waveguides with core diameters in the range of 30…70 µm. The length of the waveguides and the obtainable optical attenuation are primarily determined by the properties of the various structuring technologies themselves [11]. Due to their material properties, the optical attenuation of polymer waveguides is higher than for glass, thus, the power/performance balance for, above all, the optical connections in the backplane area is critical.…”

Section: State Of Development and Trends In Electro-optical Circuit Bmentioning

confidence: 99%

Thin glass based electrical-optical circuit boards (EOCB) using ion-exchange technology for graded-index multimode waveguides

Schröder

Arndt-Staufenbiel

Beier

et al. 2008

2008 58th Electronic Components and Technology Conference

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The concept and experimental results to manufacture electrical-optical circuit boards (EOCB) with buried optical waveguides using thin-glass sheets (display glass) are presented. An ion-exchange process was developed to manufacture the graded index waveguides in thin-glass sheets. Besides of their excellent optical properties no mechanical structuring is necessary for the waveguides. Their properties were simulated and experimentally validated. The circuit board assembly is presented, as well as the concept developed for the optical coupling in the module-to-board and board-to-backplane coupling, and the assembly of the pluggable electrical-optical module itself is described

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“…The adaptation of polymers to laser beam characteristics and vice versa is very challenging from the scientific as well as from the technological point of view. Besides the implementation of two-photon absorption microscopy (Denk et al, 1990;Denk & Svoboda, 1997) and spectroscopy (Asaka et al, 1998;Yamaguchi & Tahara, 2003), TPA is ® s for microsystems which are applied, for example, as optical interconnects or waveguides (Streppel et al, 2002;Uhlig et al, 2006), in microoptics (Bräuer et al, 2001;Houbertz et al, 2006), in electro-optical applications (Robertsson et al, 1998;Houbertz et al, 2008a), as dielectric layers (Haas et al, 2006), and as passivation materials for the encapsulation of microelectronic devices and components (Houbertz et al, 2001;2003a;2003b). The processing of an ORMOCER ® typically consists of two steps.…”

Section: Introductionmentioning

confidence: 99%

Two-Photon Polymerization of Inorganic-Organic Hybrid Polymers as Scalable Technology Using Ultra-Short Laser Pulses

Houbertz¹,

Ruth²,

Steenhusen³

et al. 2010

Coherence and Ultrashort Pulse Laser Emission

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Polymer Optical Interconnects—A Scalable Large-Area Panel Processing Approach

Cited by 36 publications

References 38 publications

Preventing of Dewetting Effects for Inorganic-Organic Hybrid Polymers Applied in Sequentially Buildup (SBU) Technology Without Surface Pretreatments

Preventing of Dewetting Effects for Inorganic-Organic Hybrid Polymers Applied in Sequentially Buildup (SBU) Technology Without Surface Pretreatments

Thin glass based electrical-optical circuit boards (EOCB) using ion-exchange technology for graded-index multimode waveguides

Two-Photon Polymerization of Inorganic-Organic Hybrid Polymers as Scalable Technology Using Ultra-Short Laser Pulses

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