Polymer Multichip Module Process Using 3-D Printing Technologies for D-Band Applications

Merkle, Thomas; Götzen, Reiner; Choi, Jah Yeon; Koch, Stefan

doi:10.1109/tmtt.2014.2387823

Cited by 31 publications

(6 citation statements)

References 53 publications

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“…2.5D/3D 垂直互连技术基于多学科多专业, 融合了系统设计和微纳集成工艺, 以实现不同材料、不同结构、不同工艺、不同功能元器件的三维异构集成, 是以突破摩尔定律极限为目的 [33] , 重点解决天线阵列微系统内部高速、高频、大功率传输下的超高密度互连难题. 共烧陶瓷型 (MCM-C) 互连基板技术 [36] .…”

Section: 5d/3d 垂直互连技术unclassified

From active phased array antenna to antenna array microsystem in post-Moore era

Wang

2020

Sci. Sin.-Inf.

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Section: 5d/3d 垂直互连技术unclassified

From active phased array antenna to antenna array microsystem in post-Moore era

Wang

2020

Sci. Sin.-Inf.

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“…Cavities and sloped vias are included in the printed package to allow for chip embedding and multilayer integration, respectively, however the feature size of the metallic interconnects is not adequate for interfacing with IC dies. In another recent effort, Merkle et al demonstrate the development of multichip modules (MCMs) for D-band (110-170 GHz) wireless applications using polymer spincoating and layer-by-layer masking for encapsulation along with physical vapor deposition (PVD) for interconnect metallization [4]. This process offers lithography-level feature sizes for interconnects and structures, however issues of large tooling time and cost are present due to the nature of lithographic processes.…”

Section: D-printed Ic Encapsulationmentioning

confidence: 99%

“…Inkjet and 3D printing technologies allow for the selective deposition of electronic materials in a 3D fashion, where dielectric and metallic patterns can be fabricated directly onto virtually any host to create fully-printed, vertically-integrated electronic systems and packages [3][4][5].…”

Section: Introductionmentioning

confidence: 99%

Inkjet and 3D Printing Technology for Fundamental Millimeter-Wave Wireless Packaging

Tehrani

Bahr

Tentzeris

2017

International Symposium on Microelectronics

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This paper outlines the design, processing, and implementation of inkjet and 3D printing technologies for the development of fully-printed, highly-integrated millimeter-wave (mm-wave) wireless packages. The materials, tools, and processes of each technology are outlined and justified for their respective purposes. Inkjet-printed 3D interconnects directly interfacing a packaging substrate with an IC die are presented using printed dielectric ramps and coplanar waveguide (CPW) transmission lines exhibiting low loss (0.6–0.8 dB/mm at 40 GHz). Stereolithography (SLA) 3D printing is presented for the encapsulation of IC dies, enabling the application-specific integration of on-package structures, including dielectric lenses and frequency selective surface (FSS)-based wireless filters. Finally, inkjet and 3D printing technology are combined to present sloped mm-wave interconnects through an encapsulation, or through-mold vias (TMVs), achieving a slope up to 65° and low loss (0.5–0.6 dB/mm at 60 GHz). The combination of these additive techniques is highlighted for the development of scalable, application-specific wireless packages.

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“…When E-plane probe transitions are used for high frequency integration and packaging, it becomes critical to realize good connections between the CPWs and chips. Under this circumstance, it would be better if the E-plane probe can be directly connected to the chip or even built on the chip [8]. Fig.…”

Section: Design Procedures Of Rectangular Waveguide-to-cpw Transimentioning

confidence: 99%

Rectangular waveguide-to-coplanar waveguide transitions at U-band using e-plane probe and wire bonding

Dong

Johansen

Zhurbenko

et al. 2016

2016 46th European Microwave Conference (EuMC)

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This paper presents rectangular waveguide-tocoplanar waveguide (CPW) transitions at U-band (40 -60 GHz) using E-plane probe and wire bonding. The designs of CPWs based on quartz substrate with and without aluminum cover are explained. The single and double layer rectangular waveguideto-CPW transitions using E-plane probe and wire bonding are designed. The proposed rectangular waveguide-to-CPW transition using wire bonding can provide 10 GHz bandwidth at Uband and does not require extra CPWs or connections between CPWs and chips. A single layer rectangular waveguide-to-CPW transition using E-plane probe with aluminum package has been fabricated and measured to validate the proposed transitions. To the authors' best knowledge, this is the first time that a wire bonding is used as a probe for rectangular waveguide-to-CPW transition at U-band.

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Polymer Multichip Module Process Using 3-D Printing Technologies for D-Band Applications

Cited by 31 publications

References 53 publications

From active phased array antenna to antenna array microsystem in post-Moore era

From active phased array antenna to antenna array microsystem in post-Moore era

Inkjet and 3D Printing Technology for Fundamental Millimeter-Wave Wireless Packaging

Rectangular waveguide-to-coplanar waveguide transitions at U-band using e-plane probe and wire bonding

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