Polymer for wafer-level hybrid bonding and its adhesion to passivation layer in 3D integration

Lu, Cheng-Hsien; Kho, Yi-Tung; Cheng, Chun‐An; Huang, Yen-Jun; Chen, Kuan‐Neng

doi:10.23919/icep.2017.7939437

Cited by 5 publications

(2 citation statements)

References 5 publications

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“…Both “adhesive first” or “metal first” methods have to involve a curing procedure in the bonding process, not only raising various problems but also increasing the bonding period. Many attempts have been made to cure the adhesive completely before hybrid bonding [ 9 , 10 ], as shown in Figure 1 c. A high-quality dielectric passivation layer was achieved because the solvent and volatile substances of the adhesive can be removed completely. Among them, polyimide is a promising adhesive due to its advances in flexibility, chemical inertness, mechanical toughness, and thermal stability at high temperatures [ 11 , 12 ], which makes it withstand manufacturing processes such as metal deposition, photolithography, and wet etching processes.…”

Section: Introductionmentioning

confidence: 99%

Direct Bonding Method for Completely Cured Polyimide by Surface Activation and Wetting

et al. 2022

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Polymer adhesives have emerged as a promising dielectric passivation layer in hybrid bonding for 3D integration, but they raise misalignment problems during curing. In this work, the synergistic effect of oxygen plasma surface activation and wetting is utilized to achieve bonding between completed cured polyimides. The optimized process achieves a void-less bonding with a maximum shear strength of 35.3 MPa at a low temperature of 250 °C in merely 2 min, significantly shortening the bonding period and decreasing thermal stress. It is found that the plasma activation generates hydrophilic groups on the polyimide surface, and the wetting process further introduces more −OH groups and water molecules on the activated polyimide surface. The synergistic process of plasma activation and wetting facilitates the bridging of polyimide interfaces to achieve bonding, providing an alternative path for adhesive bonding in 3D integration.

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Section: Introductionmentioning

confidence: 99%

Direct Bonding Method for Completely Cured Polyimide by Surface Activation and Wetting

et al. 2022

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show abstract

“…Either the "adhesive first" or the "metal first" is inevitable to involve a curing procedure in the bonding process, not only raising various problems but also increasing the bonding period. Many attempts have been made to cure adhesive completely before hybrid bonding [9,10], as shown in Figure 1(c). A high-quality dielectric passivation layer was achieved because the solvent and volatile substances of the adhesive can be removed completely.…”

Section: Introductionmentioning

confidence: 99%

Direct Bonding Method for Completely Cured Polyimide by Surface Activation and Wetting

Meng¹,

Gao²,

Wang³

et al. 2022

Preprint

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Polymer adhesives have emerged as a promising dielectric passivation layer in hybrid bonding for 3D integration while they raise misalignment problems during curing. In this work, the synergistic effect of oxygen plasma surface activation and wetting is utilized to achieve bonding between completed cured polyimides. The optimized process achieves a void-less bonding with a maximum shear strength of 35.3 MPa at a low temperature of 250 °C in merely 2 min, significantly shortening the bonding period and decreasing thermal stress. It is found that the plasma activation generated hydrophilic groups on the polyimide surface, and the wetting process further introduced more -OH groups and water molecular on the activated polyimide surface. The synergistic process of plasma activation and wetting facilitate bridging polyimide interfaces to achieve bonding, providing an alternative path for adhesive bonding in 3D integration.

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Advanced PIC Technologies and Recent Simulation Tools: A Survey

Bhuvaneshwari¹,

Caroline²

2021

J. Phys.: Conf. Ser.

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Nowadays, electronics were completely replaced by photonics as a result of substantial growth in Photonic Integrated Circuits (PICs). The expansion of photonics on various platforms such as III-V integration, silicon photonics, polymer integration and lithium Niobate techniques were reviewed and the parameters like bandwidth, data rate and bit error rate were analyzed on time and frequency domains. A study of the Photonic integration software was included such as Lumerical interconnect to interconnect PIC simulator and the co-simulation software OPTSIM tool.

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Polymer for wafer-level hybrid bonding and its adhesion to passivation layer in 3D integration

Cited by 5 publications

References 5 publications

Direct Bonding Method for Completely Cured Polyimide by Surface Activation and Wetting

Direct Bonding Method for Completely Cured Polyimide by Surface Activation and Wetting

Direct Bonding Method for Completely Cured Polyimide by Surface Activation and Wetting

Advanced PIC Technologies and Recent Simulation Tools: A Survey

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