2022
DOI: 10.1088/1361-648x/ac61b4
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Polymer curing assisted formation of optically visible sub-micron blisters of multilayer graphene for local strain engineering

Abstract: The local or global straining techniques are used to modulate the electronic, vibrational and optical properties of the two-dimensional (2D) materials. However, manipulating the physical properties of a 2D material under a local strain is comparatively more challenging. In this work, we demonstrate an easy and efficient polymer curing assisted technique for the formation of optically visible multilayer Graphene (MLG) blisters of different shapes and sizes. The detailed spectroscopic and morphological analyses hav… Show more

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Cited by 3 publications
(15 citation statements)
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“…Graphene is a mechanically robust two-dimensional (2D) material in terms of its remarkably high bendability (flexibility), elasticity, and strain-bearing capacity, which is capable of forming blisters through the confinement of different kinds of matter such as liquid, gas, nanoparticles, etc at the graphene/substrate interface [1,2]. The blisters on the surface of a 2D material like graphene offer local strain-sites with altered physical properties, and also help in probing its adhesion mechanics, which show huge potentiality for fundamental research as well as practical applications in flexible and tunable electronics, optoelectronics and nanophotonics [3][4][5][6][7][8][9][10][11][12]. Furthermore, the properties of the 2D material can be manipulated by engineering the size and the shape-profiles of the blisters [13].…”
Section: Introductionmentioning
confidence: 99%
“…Graphene is a mechanically robust two-dimensional (2D) material in terms of its remarkably high bendability (flexibility), elasticity, and strain-bearing capacity, which is capable of forming blisters through the confinement of different kinds of matter such as liquid, gas, nanoparticles, etc at the graphene/substrate interface [1,2]. The blisters on the surface of a 2D material like graphene offer local strain-sites with altered physical properties, and also help in probing its adhesion mechanics, which show huge potentiality for fundamental research as well as practical applications in flexible and tunable electronics, optoelectronics and nanophotonics [3][4][5][6][7][8][9][10][11][12]. Furthermore, the properties of the 2D material can be manipulated by engineering the size and the shape-profiles of the blisters [13].…”
Section: Introductionmentioning
confidence: 99%
“…We analyzed our previous experimental ndings on the PVAcuring-induced blistering of MLG akes 3,9 and observed that the conventional PVA-curing-induced blistering process results in 2D material blisters of lower h/s with a stable and regular interface whereas the cold mist adsorption-assisted blistering process results in the blisters of larger h/s with a complex interface. We further investigated the PVA-curing-induced blistering of MoS 2 akes under different synthesis and processing conditions to nd the crucial parameter that is directly connected to the synthesis and processing conditions used in the experiment, whether it be the conventional or cold mist adsorption-assisted blistering process.…”
Section: Resultsmentioning
confidence: 99%
“…We further investigated the PVA-curing-induced blistering of MoS 2 flakes under different synthesis and processing conditions to find the crucial parameter that is directly connected to the synthesis and processing conditions used in the experiment, whether it be the conventional or cold mist adsorption-assisted blistering process. M. Pandey et al 9 found that multilayered graphene blisters, formed spontaneously through the conventional PVA-curing-induced blistering process, follow the elastic plate model, which satisfies the condition h / τ ≲ 1.5, owing to significant bending rigidity of the multilayered flakes having minimal interlayer slippage. We find this observation to be also valid for multilayered MoS 2 blisters formed through the same blistering process.…”
Section: Resultsmentioning
confidence: 99%
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