Polymer composites with enhanced thermal conductivity via oriented boron nitride and alumina hybrid fillers assisted by 3-D printing

Liu, Mengjing; Chiang, Sun-Wai; Chu, Xiangxiang; Li, Jia; Gan, Lin; He, Yan‐Bing; Li, Baohua; Kang, Feiyu; Du, Hongda

doi:10.1016/j.ceramint.2020.05.096

Cited by 82 publications

(41 citation statements)

References 51 publications

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“…That would facilitate the formation of thermal pathways of Cu particles and lead to a higher thermal conductivity of PLA composites. It should be noted that the enhancement of thermal conductivity of the 3D printed PLA composites is higher than previous studies, which utilized metal‐ or carbon‐based fillers in the 3D printed polymer composites 37–43 . For example, the printed Cu(50 wt%)/ABS composites showed only 41% improvement on thermal conductivity compared to that of bare ABS resin 28 .…”

Section: Resultsmentioning

confidence: 71%

“…It should be noted that the enhancement of thermal conductivity of the 3D printed PLA composites is higher than previous studies, which utilized metal-or carbon-based fillers in the 3D printed polymer composites. [37][38][39][40][41][42][43] For example, the printed Cu(50 wt%)/ABS composites showed only 41% improvement on thermal conductivity compared to that of bare ABS resin. 28 The enhancement on thermal conductivity of PMMA beads-Cu/PLA composites implies a segregation effect of Cu particles in the 3D printed structures.…”

Section: Characterizationmentioning

confidence: 99%

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3D printing of copper particles and poly(methyl methacrylate) beads containing poly(lactic acid) composites for enhancing thermomechanical properties

Jeong

Kim

et al. 2020

J of Applied Polymer Sci

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Poly(lactic acid) (PLA) composite filaments with different copper (Cu) contents as high as 40 and 20 wt% of poly(methyl methacrylate) (PMMA) beads have been fabricated by twin-screw extruder for 3D printing. A fuseddeposition modeling (FDM) 3D printing technology has been used to print the PLA composites containing hybrid fillers of Cu particles and PMMA beads. The morphology, mechanical, and thermal properties of the printed PLA composites were investigated. The tensile strength was slightly decreased, but storage modulus and thermal conductivity of PLA composites were significantly improved by adding Cu particles in the presence of PMMA beads. The PLA composites with hybrid fillers of 40 wt% of Cu particles and 20 wt% of PMMA beads resulted in thermal conductivity of 0.49 W m −1 K −1 which was three times higher than that of the bare PLA resin. The facilitation of the segregated network of high-thermally conductive Cu particles with the PMMA beads in PLA matrix provided thermally conductive pathways and resulted in a remarkable enhancement in thermal conductivity.

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Section: Resultsmentioning

confidence: 71%

Section: Characterizationmentioning

confidence: 99%

3D printing of copper particles and poly(methyl methacrylate) beads containing poly(lactic acid) composites for enhancing thermomechanical properties

Jeong

Kim

et al. 2020

J of Applied Polymer Sci

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“…To our surprise, in addition to the preferred alignment of BN platelets along flow direction, there is a slight change in the orientated direction of BN platelets, which is likely related to the fact that the random distribution of www.advancedsciencenews.com www.mame-journal.de spherical Al 2 O 3 particles hinders the preferred alignment of BN platelets along the flow direction during injection molding. [41] Also, spherical Al 2 O 3 between adjacent BN platelets acts as a bridge which significantly reduces thermal resistance across the thickness direction, thereby favoring the enhancement of in both in-plane and through-plane directions. As a result, the difference between in-plane and through-plane is narrowed by constructing a dense filler packing network between planar…”

Section: Morphologymentioning

confidence: 99%

A Concurrent Enhancement of Both In‐Plane and Through‐Plane Thermal Conductivity of Injection Molded Polycarbonate/Boron Nitride/Alumina Composites by Constructing a Dense Filler Packing Structure

Bai

Shi

Zhou

et al. 2021

Macro Materials & Eng

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In this work, a facile strategy is proposed to concurrently enhance both in-plane and through-plane thermal conductivity of injection molded polycarbonate (PC)-based composites by constructing a dense filler packing structure with planar boron nitride (BN) and spherical alumina (Al 2 O 3 ) particles. The state of orientation of BN platelets is altered with the presence of Al 2 O 3 , which is favorable for improving both in-plane and through-plane thermal conductivity of subsequent moldings. Rheological analysis showed that the formation of intact thermal conductive pathways is crucial to the overall enhancement of thermal conductivity. Both in-plane and through-plane thermal conductivity of PC/BN(20 wt%)/Al 2 O 3 (40 wt%) composites reached as high as 1.52 and 1.09 W mK −1 , which are 485% and 474% higher than that of pure PC counterparts, respectively. Furthermore, the prepared samples demonstrated excellent electrical insulation and dielectric properties which show potential application in electronic and automotive industries.

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“…Apart from polymers, hybrid fillers can potentially escalate the effectivity of the fillers' role throughout the matrix, more than individual h-BN sheets. The combination of different thermal conductive fillers like CNT [35,71], Graphene [72][73][74], Graphite [27,75], ZnO [76], Al 2 O 3 [77], and so on, with h-BN, leads to a synergetic effect in the TC performances among counterparts [68]. As an example, a promising hybrid nanocomposite of in-situ grown CNT on BNNSs embedded in epoxy resin exhibited a 615% and 380% TC performance improvement for the cross-plane direction compared with pure epoxy and BNNSs/epoxy composite, respectively.…”

Section: H-bn Within Hybrid Filler Configurationsmentioning

confidence: 99%

Recent Progress in the Study of Thermal Properties and Tribological Behaviors of Hexagonal Boron Nitride-Reinforced Composites

et al. 2020

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Ever-increasing significance of composite materials with high thermal conductivity, low thermal expansion coefficient and high optical bandgap over the last decade, have proved their indispensable roles in a wide range of applications. Hexagonal boron nitride (h-BN), a layered material having a high thermal conductivity along the planes and the band gap of 5.9 eV, has always been a promising candidate to provide superior heat transfer with minimal phonon scattering through the system. Hence, extensive researches have been devoted to improving the thermal conductivity of different matrices by using h-BN fillers. Apart from that, lubrication property of h-BN has also been extensively researched, demonstrating the effectivity of this layered structure in reduction of friction coefficient, increasing wear resistance and cost-effectivity of the process. Herein, an in-depth discussion of thermal and tribological properties of the reinforced composite by h-BN will be provided, focusing on the recent progress and future trends.

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Polymer composites with enhanced thermal conductivity via oriented boron nitride and alumina hybrid fillers assisted by 3-D printing

Cited by 82 publications

References 51 publications

3D printing of copper particles and poly(methyl methacrylate) beads containing poly(lactic acid) composites for enhancing thermomechanical properties

3D printing of copper particles and poly(methyl methacrylate) beads containing poly(lactic acid) composites for enhancing thermomechanical properties

A Concurrent Enhancement of Both In‐Plane and Through‐Plane Thermal Conductivity of Injection Molded Polycarbonate/Boron Nitride/Alumina Composites by Constructing a Dense Filler Packing Structure

Recent Progress in the Study of Thermal Properties and Tribological Behaviors of Hexagonal Boron Nitride-Reinforced Composites

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