Polymer Composite with Enhanced Thermal Conductivity and Insulation Properties through Aligned Al2O3 Fiber

Abstract

Thermoplastic polyolefins, such as polyethylene (PE), are traditionally one of the most widely used polymer classes with applications in the electric industry, and their nanocomposites have caught the interest of researchers. The linear filler is shown to be beneficial in decreasing the charge injection and hindering the formation of charge packs. So, we demonstrate a novel composite with excellent properties. The low-density polyethylene (LDPE) composite with aligned aluminum oxide (Al2O3) fiber has been prepared in electric field conditions. The direction of the Al2O3 fiber was parallel to the thickness direction of the LDPE composite. The breakdown strength of the Al2O3/LDPE composite with 0.2% aligned Al2O3 fiber was 498 kV/mm, which is higher than other fillers induced. The aligned Al2O3 fiber has effect on preventing accumulation of space charge and reducing the amount of free electron in the material. In addition, the thermal conductivity of the LDPE composite (0.22 W/m·K) was increased to 0.85 W/m·K when doped with 0.5 wt% aligned Al2O3 fiber. The present structure provides a new possibility for mass new nanocomposites with excellent microstructures and remarkable functionality.

Achieving High Thermal Conductivity, Good Electrical Insulation, and Balanced Mechanical Properties in Biodegradable Polymer Composites with Low Filler Content

“…One effective approach to enhancing the thermal conductivity of biodegradable polymers is incorporating high thermal/ conductive fillers through melt blending. 12 Commonly used thermal fillers include silicon carbide (SiC), 13,14 aluminum oxide (Al 2 O 3 ), 15 aluminum nitride (AlN), 16 and boron nitride (BN). 17−19 Nevertheless, high filler loadings can negatively impact mechanical properties and impose processing difficulties.…”

“…One effective approach to enhancing the thermal conductivity of biodegradable polymers is incorporating high thermal/conductive fillers through melt blending . Commonly used thermal fillers include silicon carbide (SiC), , aluminum oxide (Al 2 O 3 ), aluminum nitride (AlN), and boron nitride (BN). − Nevertheless, high filler loadings can negatively impact mechanical properties and impose processing difficulties . An alternative solution involves using highly conductive fillers like carbon nanotubes (CNTs) , and graphene to achieve enhanced thermal conductivity at lower filler loadings, thus mitigating the negative effects of high filler content.…”