Polymer characterization by thermal evolution techniques

Chiu, Jen; Palermo, E.F.

doi:10.1016/s0003-2670(00)89453-2

Cited by 7 publications

(1 citation statement)

References 46 publications

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“…This practical approach in evaluating thermal resistance and thermal degradation was also applied to a variety of commercial aromatic polymers 14 including polyimides, poly-(etherimide), poly(ether sulfone), poly(aryl ether ether ketone), and poly(p-xylylene). Figure 8(a) and (b) shows decomposition profiles of DGEBA/II at various heating rates (ϳ 5-40°C/min) under nitrogen or air, respectively.…”

Section: Activation Energy Of Degradationmentioning

confidence: 99%

Properties and curing kinetic of diglycidyl ether of bisphenol A cured with a phosphorus-containing diamine

Wang

Lin

1999

J. Appl. Polym. Sci.

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Diglycidyl ether of bisphenol A (DGEBA) was cured with a new phosphorus-containing diamine, 1,4-bis(3-aminobenzoyloxy)-2-(6-oxido-6H-dibenz͗c,e͗͘1,2͘oxa-phosphorin-6-yl)phenylene II, which was derived from 2-(6-oxido-6H-dibenz͗c,e͗͘1,2͘-oxaphosphorin-6-yl)-1,4-dihydroxy phenylene and 3-nitrobenzoyl chloride followed by hydrogenation. The structure of the synthesized phosphorus-containing curing agent II was confirmed through EA, IR, 1 H-NMR, and 31 P-NMR. The curing kinetics of the DGEBA/II system were studied by the dynamic and isothermal DSC method. Dynamic kinetic parameters were calculated by using the Kissinger and Ozawa's methods, respectively. Isothermal kinetic parameters, including k 1 , k 2 , m, and n, were determined by an autocatalytic mechanism proposed by Kamal. The model gives a good description of curing kinetics up to the onset of vitrification. The glass transition temperatures of cured epoxy (DGEBA/II) were 180°C based on DMA and 170°C by DSC, respectively. The onset decomposition temperatures (T d onset) were 376 and 367°C under nitrogen and air, respectively. Char yields at 700°C were 38 and 18% under nitrogen and air, respectively. Limiting oxygen index (LOI) was 30, thus the phosphorus-containing diamine curing agent II was found to impart flame retardancy to the cured epoxy resin.

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Section: Activation Energy Of Degradationmentioning

confidence: 99%