Polymer/boron nitride nanosheet composite with high thermal conductivity and sufficient dielectric strength

Yu, Jinhong; Mo, Hailin; Jiang, Pingkai

doi:10.1002/pat.3481

Cited by 96 publications

(67 citation statements)

References 28 publications

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“…To reduce the large interfacial thermal resistance between the 2D-fillers and the matrix, the surface functionalization of 2D fillers, such as graphene, and BN nanosheets has been widely studied. A strong covalent bonding of BN nanosheets on epoxy matrix could result in a higher thermal conductivity [208].…”

Section: ) 2d Fillers (Graphene and Boron Nitride)mentioning

confidence: 99%

Thermal conductivity of polymers and polymer nanocomposites

Huang

Qian

Yang

2018

Materials Science and Engineering: R: Reports

640

391

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Polymers are widely used in industry and in our daily life because of their diverse functionality, light weight, low cost and excellent chemical stability. However, on some applications such as heat exchangers and electronic packaging, the low thermal conductivity of polymers is one of the major technological barriers. Enhancing the thermal conductivity of polymers is important for these applications and has become a very active research topic over the past two decades. In this review article, we aim to: 1). systematically summarize the molecular level understanding on the thermal transport mechanisms in polymers in terms of polymer morphology, chain structure and inter-chain coupling; 2). highlight the rationales in the recent efforts in enhancing the thermal conductivity of nanostructured polymers and polymer nanocomposites. Finally, we outline the main advances, challenges and outlooks for highly thermal-conductive polymer and polymer nanocomposites. the inter-chain coupling. Fig. 1 Schematic diagrams of a polymer: (a) the morphology of a polymer consisting of crystalline and amorphous domains; (b) structure of a polymer chain.In addition to engineering the morphology of polymer chains, another common method to enhance the thermal conductivity of polymers is to blend polymers with highly thermal conductive fillers. The progress of nanotechnology over the last two decades not only provides more diverse high thermal conductivity fillers of different material types and topological shapes but also advances the understanding at the nanoscale. Fig. 2 shows a sketch of a polymer nanocomposite to illustrate the thermal transport mechanisms. In general, there are two types of polymer nanocomposites depending on whether nano-fillers form a network or not. When the filler concentration is low, no inter-filler networks could be formed, as shown in Fig. 2(a). The thermal conductivity is essentially determined by the filler-matrix coupling, i.e, interfacial thermal resistance, and the concentration and the geometric shapes of fillers. When the filler concentration is large enough, high conductivity fillers might form thermally conductive networks, as shown in Fig. 2(b). Although nanocomposites with filler network could possess a higher thermal conductivity than that without a network, their thermal conductivity could still be low due to the large inter-filler thermal contact resistance. Recently, three-dimensional fillers, such as carbon and graphene foams, have drawn a lot of attention. The fundamental thermal transport mechanisms and recent synthesis efforts in both types of nanocomposites are reviewed.This review article is organized as follows. In Section 2, we introduce the experimental progress on the enhancement of thermal conductivity by aligning polymer chains, and then review the methods to further tune the thermal conductivity by engineering chain structure and inter-chain coupling, as illustrated in Fig. 3(a). In Section 3, we discuss the thermal conductivity of polymer nanocomposites both with and without inter...

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Section: ) 2d Fillers (Graphene and Boron Nitride)mentioning

confidence: 99%

Thermal conductivity of polymers and polymer nanocomposites

Huang

Qian

Yang

2018

Materials Science and Engineering: R: Reports

640

391

View full text Add to dashboard Cite

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“…As filler, we selected hexagonal boron nitride (h‐BN), which has gained great popularity in recent years in the field of high thermal conductivity. This is due to the combination of properties: high thermal conductivity in planar direction, good dielectric properties, low thermal expansion coefficient (CTE) and density below other kind of particles . We recently studied similar curing processes based on a diglycidylether of bisphenol A (DGEBA) resin .…”

Section: Introductionmentioning

confidence: 99%

New epoxy composite thermosets with enhanced thermal conductivity and high T_g obtained by cationic homopolymerization

et al. 2018

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Thermal dissipation is a critical aspect for the performance and lifetime of electronic devices. In this work, novel composites based on a cycloaliphatic epoxy matrix and BN fillers, obtained by cationic curing of mixtures of 3,4‐epoxy cyclohexylmethyl 3,4‐epoxy cyclohexane carboxylate (ECC) with several amounts of hexagonal boron nitride (BN) were prepared and characterized. As cationic initiator a commercial benzylanilinium salt was used, which by addition of triethanolamine, exhibited an excellent latent character and storage stability. The effect of the formulation composition was studied by calorimetry and rheological measurements. The variation of thermal conductivity, thermal stability, thermal expansion coefficient, and thermomechanical and mechanical properties of the composites with the load of BN filler (ranging from 10 to 40 wt%) was evaluated. An improvement of an 800% (1.04 W/m·K) in thermal conductivity was reached in materials with glass transition temperatures >200°C without any loss in electrical insulation. POLYM. COMPOS., 39:E1760–E1769, 2018. © 2018 Society of Plastics Engineers

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“…Currently, research and development of high‐performance composites with fine thermal conductivity have caught the world's attention because of their great promise in numerous sophisticated industries, such as microelectronics, aerospace, and aviation . For example, as integrated circuit chips move toward higher density and higher frequency, higher amounts of waste heat have to be removed to stabilize the chips work …”

Section: Introductionmentioning

confidence: 99%

“…1,2 For example, as integrated circuit chips move toward higher density and higher frequency, higher amounts of waste heat have to be removed to stabilize the chips work. 3 The low thermal conductivity of polymeric materials is caused by the slow heat transfer of phonons along the temperature gradient. A feasible way to address the thermal issue of devices is to improve thermal conductivity of polymers by adding high thermal conductivity inorganic fillers.…”

Section: Introductionmentioning

confidence: 99%

Synergetic effect of thermal conductivity and flame retardancy of cyanate ester composites containing DOPO and BN with great dielectric properties

Yao

Wang

Chen

et al. 2019

Polymers for Advanced Techs

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DOPO and boron nitride (BN) fillers with different particle sizes and several loadings were employed to improve the properties of cyanate ester (CE) resin. The effects of BN content and particle size on the thermal conductivity of the BN‐DOPO/CE ternary composites were discussed. The influence of enhancing the thermal conductivity of the ternary composites on their flame retardancy was studied. The consequences showed that increasing the thermal conductivity of BN‐DOPO/CE composites had an active impact on their flame retardancy. Approving flame retardancy of the ternary composites was certified by the high limiting oxygen index (LOI), UL‐94 rating of V‐0, and low heat release rate (HRR) and total heat release (THR). For instance, in contrast with pure CE matrix, peak of HRR (pk‐HRR), average of HRR (av‐HRR), THR, and average of effective heat of combustion (av‐EHC) of CEP/BN0.5 μm/10 composite were decreased by 51.7%, 33.8%, 18.7%, and 18.9%, respectively. Thermal gravimetry analysis (TGA) showed that the addition of BN fillers improves the thermal stability of the composites. Moreover, the ternary composites possess good dielectric properties. Their dielectric constants (ε) are less than 3, and dielectric loss tangent (tgδ) values are lower than neat CE resin.

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Polymer/boron nitride nanosheet composite with high thermal conductivity and sufficient dielectric strength

Cited by 96 publications

References 28 publications

Thermal conductivity of polymers and polymer nanocomposites

Thermal conductivity of polymers and polymer nanocomposites

New epoxy composite thermosets with enhanced thermal conductivity and high T_g obtained by cationic homopolymerization

Synergetic effect of thermal conductivity and flame retardancy of cyanate ester composites containing DOPO and BN with great dielectric properties

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Polymer/boron nitride nanosheet composite with high thermal conductivity and sufficient dielectric strength

Cited by 96 publications

References 28 publications

Thermal conductivity of polymers and polymer nanocomposites

Thermal conductivity of polymers and polymer nanocomposites

New epoxy composite thermosets with enhanced thermal conductivity and high Tg obtained by cationic homopolymerization

Synergetic effect of thermal conductivity and flame retardancy of cyanate ester composites containing DOPO and BN with great dielectric properties

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New epoxy composite thermosets with enhanced thermal conductivity and high T_g obtained by cationic homopolymerization