[1992] Proceedings IEEE Micro Electro Mechanical Systems 1992
DOI: 10.1109/memsys.1992.187699
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Polymer bonding of micro-machined silicon structures

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Cited by 45 publications
(15 citation statements)
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“…[72] Second, the precursor should be mixed with polymer-matrix like polyimide and epoxy (PCBS) such as tetraethylorthosilicate (TEOS). [73] The process was also applied to TiO 2 /polymer nanocomposites preparation.…”
Section: Sol-gel Processmentioning
confidence: 99%
“…[72] Second, the precursor should be mixed with polymer-matrix like polyimide and epoxy (PCBS) such as tetraethylorthosilicate (TEOS). [73] The process was also applied to TiO 2 /polymer nanocomposites preparation.…”
Section: Sol-gel Processmentioning
confidence: 99%
“…As the intermediate layer, for example, another glass [17], boron oxide [18], sodium silicate [19] and polymer thin films [20] can be used. These processes all have their own disadvantages such as elevated process temperatures, flat surfaces that are required or they form a weak bond.…”
Section: Interface Between Cooler and Image Sensormentioning
confidence: 99%
“…Nowadays, the use of pieces with reduced dimensions has increased in several commercial sectors, especially in electronic and medicine fields. Some examples of these devices are microchips, nanoneedles or pumps for microfluidics [1][2][3]. The wide range of applications and the high resolution 2 of 17 required for the final performance have enhanced the interest towards the use of polymers for these purposes due to their versatility.…”
Section: Introductionmentioning
confidence: 99%