Abstract:The development of low resistivity material to increase the rate capability of Resistive Plate Chambers (RPCs) has been attracting more and more attention recently. This paper presents a new type of such a material. The new material is based on polyimide doped with carbon. The electrical volume resistivity of this material could be controlled using different percentages of the doping carbon. The standard thickness of polyimide carbon films is around 40 µm which does not allow to use it as such to build the RPC… Show more
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