Polyimide Based Hybrid Nanocomposites

Wahab, M. A.; Kim, Ii; Cho, Won‐Jei; Ha, Chang‐Sik

doi:10.1080/15421400490478560

Cited by 13 publications

(12 citation statements)

References 7 publications

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“…Polyimide structure has remarkable heat resistance, which reaches for a short time up to a temperature of 600 C. It is one of silicon polymers which are based on an inorganic silicon-oxygen structure that has organic radicals attached to silicon atoms. Polyimides nanocomposites made of hybrid organic-inorganic components are important class of new materials with tailored physical properties [5][6][7][8][9][10][11].…”

Section: Introductionmentioning

confidence: 99%

Electrical and thermal properties of polyimide/silica nanocomposite

Tommalieh

Zihlif

Ragosta

2011

Journal of Experimental Nanoscience

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The electrical and thermal properties of thin films of polyimide/silica nanocomposites prepared via sol-gel process were studied as a function of nanosilica particles content, temperature and applied field frequency. It was found that the dielectric constant and dielectric loss of the nanocomposites decrease with both the frequency and the nanosilica content, while increase with temperature. The AC-conductivity measured in frequency range 200 kHz-1.5 MHz decreases with the filler concentration and increases with increasing temperature. For the (25 wt%) nanocomposite, it was found that the AC-conductivity increases with temperature, and the Cole-Cole plots showed that the calculated activation energy and relaxation time decrease with temperature. The observed thermal conductivity increases gently with temperature. The empirical universal law was used to fit the observed electrical data under the measuring conditions.

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Section: Introductionmentioning

confidence: 99%

Electrical and thermal properties of polyimide/silica nanocomposite

Tommalieh

Zihlif

Ragosta

2011

Journal of Experimental Nanoscience

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“…A great number of PI is widely studied for application as suitable polymer matrices, adhesive materials, highly efficient coatings for microelectronics [136][137][138][139][140][141][142]. They are obtained by the scheme (Fig.…”

Section: Formation Of Inorganic Precursor In Presence Of Organic Polymentioning

confidence: 99%

Physics and Chemistry of Sol-Gel Nanocomposites Formation

Pomogailo

Джардималиева

2014

Nanostructured Materials Preparation via Condensation Ways

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This method called sol-gel or dip-and spin-on-glass process, spin-spray-coating, sol -gel glasses, which was widely used in the second half of the twentieth century [1] 1 is one of the most universal condensation ways of production of nanoparticles stabilized by inorganic oxide or polymeric matrices. A special interest is attracted to materials obtained by combination of sol-gel chemistry and aerosol or spray processes, and combination of sol-gel synthesis with intercalation. This also includes combinations of sol-gel processes with different types of thermolysis, and approaches met in nature in biomineralization processes, etc., which are new aspects of integrative chemistry approach. Traditional sol-gel concept is based on hydrolysis and condensation of metal alkoxides and many metalloids including different ways of their modification [2,3]. Main reactions proceed at relatively low temperatures with usage of prepared in advance or synthesized in parallel polymers, and are convenient techniques for preparation of organic-inorganic nanocomposites compared with commercial silicate-intercalation technique. Sizes of formed nanoparticles in a composite can be reduced to 10 nm by choice of relative conditions. Polymer-inorganic materials have high mechanical strength and thermal stability in combination with optimal heat transport properties. They are widely used in practice due to unique physical and chemical properties: incorporation of nanometric inorganic component into polymeric matrix improves mechanical properties of material [4][5][6][7], permeability of polymers [8]. Light-sensitive materials are used in optic and electronic industry, printed-circuit boards, photoconductive cells, as key elements in solid coatings, packing materials, as cover materials they have good transparency [9][10][11]. For example, sol-gel method was used to produce various polymer/TiO 2 composites with high refractive index [12]. Such type of composites are used for chromatographic carriers, membrane materials, these are the main class of plastics for different applications, including airspace. Controlled properties of the surface of these colloid 1 We refer here to the recent review devoted to celebration of 40th anniversary of innovation researches in polymer-inorganic ceramics produced by sol-gel technique [1].

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“…Therefore, a large number of PI compositions have been extensively investigated and most of them are well-suited for use as matrix resins, adhesives, and coatings for high-performance applications in the aerospace, electric, and micro-electronic industries. [1][2][3][4] However, to some extent, their high thermal expansivity and relatively high dielectric constant limit their further applications. Currently, to meet the demand of highly miniaturized electronic devices, super conductive cables, and development of next generation spacecrafts, many research efforts have been focused on the further improvement of the PI properties by the introduction of nanocomposite hybrids.…”

Section: Introductionmentioning

confidence: 99%

Polyimide–silica hybrid coatings: morphological, mechanical, and thermal investigations

Karataş

Kayaman‐Apohan

Demirer

et al. 2007

Polymers for Advanced Techs

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In this study, polyimide-silica (PI-silica) based hybrid coating compositions were prepared from tetraethoxysilane (TEOS), g-glycidyloxypropyl trimethoxy silane (GOTMS), and polyamic acid (PAA) via a combination of sol-gel and thermal imidization techniques. PAA was synthesized from 3,3(,4,4(-benzophenone tetracarboxylic dianhydride (BTDA) and 3,3'-Diaminodiphenyl sulfone (DDS) in N-Methyl-2-pyrrolidone (NMP). The silica content in the hybrid coatings was varied from 0 to 20 wt%. The structural characterization of the hybrid coatings was performed using FTIR and 29 Si-NMR spectroscopies. Results from both pendulum hardness and micro indentation test show that the hardness of hybrid coatings improves with the increase in silica content. The tensile tests also demonstrated that the mechanical properties at low silica content are rather striking. Their surface morphologies were characterized by scanning electron microscopy (SEM). SEM studies revealed that inorganic particles were distributed homogenously through the PI matrix. It was also found that, incorporation of the silica domains increased the thermal stability of the hybrid coatings.

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Polyimide Based Hybrid Nanocomposites

Cited by 13 publications

References 7 publications

Electrical and thermal properties of polyimide/silica nanocomposite

Electrical and thermal properties of polyimide/silica nanocomposite

Physics and Chemistry of Sol-Gel Nanocomposites Formation

Polyimide–silica hybrid coatings: morphological, mechanical, and thermal investigations

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