2020
DOI: 10.1016/j.patrec.2018.12.013
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Polycrystalline silicon wafer defect segmentation based on deep convolutional neural networks

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Cited by 65 publications
(32 citation statements)
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“…In reference to [18], predicted results are compared with ground truth images using five metrics: mean-Intersection-over-Union (m-IOU), accuracy, recall, precision and F-measure. The IOU, accuracy, recall, precision and F-measure are computed by Equations (13), (14), (15), (16) and (17) Table.2.…”
Section: Experiments Results and Analysis A Evaluation Metricmentioning
confidence: 99%
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“…In reference to [18], predicted results are compared with ground truth images using five metrics: mean-Intersection-over-Union (m-IOU), accuracy, recall, precision and F-measure. The IOU, accuracy, recall, precision and F-measure are computed by Equations (13), (14), (15), (16) and (17) Table.2.…”
Section: Experiments Results and Analysis A Evaluation Metricmentioning
confidence: 99%
“…In this paper, we compare the multi attention u-net with Tsai's method [9], SEF method [11] and Han's u-net [15]. We evaluate the segmentation performance of proposed method and state of the art methods using k-Fold cross validation.…”
Section: Segmentation Resultsmentioning
confidence: 99%
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“…In the wafer defect detection, CNN also achieved a good performance. Hui Han proposed a defect segmentation method for polycrystalline silicon wafer by means of the deep convolutional networks, which can segment various defects in silicon wafer by training with small amount of roughly marked defect images [22]. Nakazawa presented a method for wafer map defect detection by using CNN.…”
Section: Introductionmentioning
confidence: 99%