“…Dielectric materials with their energy storing capacity have a plethora of applications particularly in designing capacitors, transformers, resonators, transistors, photovoltaic devices, integrated circuits (ICs), and so on. , With the emerging advancements and innovations in the semiconductor industry, the synthesis of novel dielectric materials has become a topic of great interest, particularly with regard to their use in designing multilevel nanoscale flexible electronic technology. , Because of the shrinkage in the size of electronic components, the efficiency of traditional dielectric materials is a serious concern. Traditional materials such as SiO 2 , AlO 2 , and other inorganic metal oxide materials have reached their functional limits. , Hence, low dielectric behavior has been reported for mesoporous silica composites, − fluorine-containing carbon materials, porous polybenzoxazole-based films, − poly( p -xylylene) polymers, and organometallic compounds, while methacrylate polymers, styrenes, poly(4-vinylphenol) (PVP), poly(vinylidene fluoride) (PVDF), and POSS polymers have been used as high dielectric gate polymeric materials. , However, these organic dielectric materials possess some series issues regarding their thermal stability, mechanical strength, compatibility with other inorganic components of devices, and the fact that they degrade over time. , Very recently, hybrid inorganic–organic dielectric materials have emerged as an alternative to organic as well inorganic dielectrics with unique features of having both organic and inorganic molecules within a single material. − …”