2016
DOI: 10.1063/1.4944748
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Poly(4-vinylphenol) gate insulator with cross-linking using a rapid low-power microwave induction heating scheme for organic thin-film-transistors

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Cited by 16 publications
(10 citation statements)
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“…Because of that, the hydrophilic surface of PVA results in poor surface conditions, which inhibits the growth of the pentacene grain. It has been reported [27] that the hydrophilic condition can be represented by the measured contact angle of the surface. The contact angle of the samples with a single PVA, single PVP, and bilayer high-K PVA/low-K PVP, respectively, were measured using the sessile drop method, as shown in Figure 6.…”
Section: Resultsmentioning
confidence: 99%
“…Because of that, the hydrophilic surface of PVA results in poor surface conditions, which inhibits the growth of the pentacene grain. It has been reported [27] that the hydrophilic condition can be represented by the measured contact angle of the surface. The contact angle of the samples with a single PVA, single PVP, and bilayer high-K PVA/low-K PVP, respectively, were measured using the sessile drop method, as shown in Figure 6.…”
Section: Resultsmentioning
confidence: 99%
“…Klauk et al [29] reported better electrical properties using PVP gate dielectric layers than SiO 2 gate dielectric layers [67]. However, PVP is not stable at ambient conditions owing to its poor resistance to humidity, thus it requires stabilizers such as poly(melamine-coformaldehyde) methylated (PMF), working as a cross-linking agent, in propylene-glycol-monomethyl-ether-acetate (PGMEA) [68].…”
Section: Non-metallic Inksmentioning
confidence: 99%
“…Dielectric materials with their energy storing capacity have a plethora of applications particularly in designing capacitors, transformers, resonators, transistors, photovoltaic devices, integrated circuits (ICs), and so on. , With the emerging advancements and innovations in the semiconductor industry, the synthesis of novel dielectric materials has become a topic of great interest, particularly with regard to their use in designing multilevel nanoscale flexible electronic technology. , Because of the shrinkage in the size of electronic components, the efficiency of traditional dielectric materials is a serious concern. Traditional materials such as SiO 2 , AlO 2 , and other inorganic metal oxide materials have reached their functional limits. , Hence, low dielectric behavior has been reported for mesoporous silica composites, fluorine-containing carbon materials, porous polybenzoxazole-based films, poly­( p -xylylene) polymers, and organometallic compounds, while methacrylate polymers, styrenes, poly­(4-vinylphenol) (PVP), poly­(vinylidene fluoride) (PVDF), and POSS polymers have been used as high dielectric gate polymeric materials. , However, these organic dielectric materials possess some series issues regarding their thermal stability, mechanical strength, compatibility with other inorganic components of devices, and the fact that they degrade over time. , Very recently, hybrid inorganic–organic dielectric materials have emerged as an alternative to organic as well inorganic dielectrics with unique features of having both organic and inorganic molecules within a single material. …”
Section: Introductionmentioning
confidence: 99%
“…5,6 Hence, low dielectric behavior has been reported for mesoporous silica composites, 7−9 fluorine-containing carbon materials, 10 porous polybenzoxazole-based films, 11−13 poly(pxylylene) polymers, and organometallic compounds, 14 while methacrylate polymers, styrenes, poly(4-vinylphenol) (PVP), poly(vinylidene fluoride) (PVDF), and POSS polymers have been used as high dielectric gate polymeric materials. 15,16 However, these organic dielectric materials possess some series issues regarding their thermal stability, mechanical strength, compatibility with other inorganic components of devices, and the fact that they degrade over time. 17,18 Very recently, hybrid inorganic−organic dielectric materials have emerged as an alternative to organic as well inorganic dielectrics with unique features of having both organic and inorganic molecules within a single material.…”
Section: ■ Introductionmentioning
confidence: 99%