2018
DOI: 10.1002/adom.201800351
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Polarization‐Sensitive and Broadband Photodetection Based on a Mixed‐Dimensionality TiS3/Si p–n Junction

Abstract: polarization-sensitive photodetectors and polarimeters. [6] Up to now, however, most of the reported works on photodetectors based on 2D semiconductors are focused on transition metal dichalcogenides or other chalcogenides with marked in-plane isotropic properties and thus the built-up photodetectors are insensitive to polarized light. [3a,7] The amount of works exploring the use of dichroic 2D semiconductors is still scarce and they are mostly limited to devices with low detectivity values or with a limited… Show more

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Cited by 68 publications
(56 citation statements)
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“…While erroneous, this method allows for a comparison to other detectors reported in the literature that use this method. Under this view, the performance of the polarized detectors compare well to other all‐polymer organic photodetectors, and other intrinsic polarized detectors …”
Section: Resultsmentioning
confidence: 76%
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“…While erroneous, this method allows for a comparison to other detectors reported in the literature that use this method. Under this view, the performance of the polarized detectors compare well to other all‐polymer organic photodetectors, and other intrinsic polarized detectors …”
Section: Resultsmentioning
confidence: 76%
“…While the polymers align in the direction of strain, the local polymer order in the film is kept allowing the films to maintain high quantum efficiency. In fact, the photodetector performance in terms of R , detectivity, and 3 dB cutoff frequency is among the highest reported for all‐polymer photodetectors, and intrinsically polarization‐sensitive organic or inorganic photodetectors . In summary, the demonstrated devices highlight the opportunity of all‐polymer photodetectors to achieve high‐performance intrinsically polarization‐sensitive photodetectors with broad spectral response.…”
Section: Resultsmentioning
confidence: 82%
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“…70 . Photodetector devices with n-and p-type silicon substrates were produced by etching a 1 × 1 cm square of thermally grown SiO 2 with a sodium biflouride etch solution as described elsewhere 71 . The freshly exposed underlying Si was then directly abraded with TMDC powder until no pin-holes were observable under a ×50 microscope objective.…”
Section: Methodsmentioning
confidence: 99%