“…Recently, silicon photonic integrations, based on complementary metal oxide semiconductor (CMOS)-compatible processes, have shown great application prospects in optical communications, optical interconnections, optical sensing, and optical computing because of their compact size, low power consumption, and low cost [ 1 , 2 , 3 , 4 , 5 , 6 , 7 , 8 , 9 , 10 , 11 , 12 , 13 , 14 ]. The process nodes used by mainstream silicon photonic manufacturers are usually 130 nm or 180 nm for low-cost production, which inevitably introduces fabrication errors in the devices.…”