2016
DOI: 10.1117/12.2220586
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PMMA removal selectivity to PS using dry etch approach: sub-10nm patterning application

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Cited by 2 publications
(3 citation statements)
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“…This result is in good agreement with a previous study showing an increase in the CD after CO-H 2 chemistry as a function of the process time. 15 In the meantime, these cross-section views confirm a low PMMA consumption and no PS etch with the 15 s-CO step as already observed on blanket wafers, while 30 nm of PMMA and 10 nm of PS are removed with the 25 s-CO-H 2 step.…”
Section: Application To Ps-b-pmma Films With a Cylindrical Morphologysupporting
confidence: 80%
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“…This result is in good agreement with a previous study showing an increase in the CD after CO-H 2 chemistry as a function of the process time. 15 In the meantime, these cross-section views confirm a low PMMA consumption and no PS etch with the 15 s-CO step as already observed on blanket wafers, while 30 nm of PMMA and 10 nm of PS are removed with the 25 s-CO-H 2 step.…”
Section: Application To Ps-b-pmma Films With a Cylindrical Morphologysupporting
confidence: 80%
“…To have a better understanding, we have compared XPS analysis obtained for the cycling chemistry with results obtained for CO and CO-H 2 chemistry which have been previously presented in detail. 15 PS and PMMA surface compositions for CO and CO-H 2 processes have been plotted in Fig. 4.…”
Section: B Plasma-materials Interaction Understandingmentioning
confidence: 99%
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