PMMA-Based Wafer-Bonded Capacitive Micromachined Ultrasonic Transducer for Underwater Applications

Ahmad, Mansoor; Bozkurt, Ayhan; Farhanieh, Omid

doi:10.3390/mi10050319

Cited by 5 publications

(4 citation statements)

References 41 publications

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“…As such, we speculated that the room-temperature cured ECAs cannot provide a robust contact with low resistance during the high temperature bonding process (> 200 °C). However, the applications of the ECAs in TSV technology will not be limited due to the low-temperature (< 200 °C) bonding technology innovations that can overcome issues related to the high temperature bonding process, for instance, cracks of thinned and fragile wafer during bonding, performance degradation under higher bonding temperature, serious wafer/chip warpage, bonding misalignment, and compatibility with the back-end-of-line process conditions and materials [41,42,43].…”

Section: Resultsmentioning

confidence: 99%

A Novel Seedless TSV Process Based on Room Temperature Curing Silver Nanowires ECAs for MEMS Packaging

et al. 2019

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The through-silicon-vias (TSVs) process is a vital technology in microelectromechanical systems (MEMS) packaging. The current via filling technique based on copper electroplating has many shortcomings, such as involving multi-step processes, requiring sophisticated equipment, low through-put and probably damaging the MEMS devices susceptible to mechanical polishing. Herein, a room temperature treatable, high-efficient and low-cost seedless TSV process was developed with a one-step filling process by using novel electrically conductive adhesives (ECAs) filled with silver nanowires. The as-prepared ECAs could be fully cured at room temperature and exhibited excellent conductivity due to combining the benefits of both polymethyl methacrylate (PMMA) and silver nanowires. Complete filling of TSVs with the as-prepared 30 wt% silver nanowires ECAs was realized, and the resistivity of a fully filled TSV was as low as 10−3 Ω·cm. Furthermore, the application of such novel TSV filling process could also be extended to a wide range of different substrates, showing great potential in MEMS packaging, flexible microsystems and many other applications.

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Section: Resultsmentioning

confidence: 99%

A Novel Seedless TSV Process Based on Room Temperature Curing Silver Nanowires ECAs for MEMS Packaging

et al. 2019

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“…Furthermore, capacitive clamped membranes offer a higher bandwidth and low concentration level detection of volatile organic compounds [ 69 , 72 , 92 , 93 , 94 , 95 ]. They are batch produced by using advanced fabrication techniques in microelectromechanical systems such as sacrificial or bonding techniques [ 67 , 96 , 97 , 98 , 99 , 100 , 101 , 102 , 103 ].…”

Section: Discussionmentioning

confidence: 99%

Capacitive Based Micromachined Resonators for Low Level Mass Detection

et al. 2020

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Advancements in microfabrication technologies and novel materials have led to new innovations in miniaturized gas sensors that can identify miniscule changes in a complex environment. Micromachined resonators with the capability to offer high sensitivity and selectivity in array integration make mass loading a potential mechanism for electronic nose applications. This paper investigates the mass sensing characteristics of progressive capacitive based micromachined resonators as potential candidates for volatile organic compound detection where also there is a need for miniaturized array configuration. In this paper, a detailed investigative review of the major three geometric designs of capacitive based micromachined resonators, namely, the microcantilever, the microbridge and the clamped membrane sensors is performed. Although many reviews are present in literature regarding mass sensors, however there is a gap in the literature regarding the common capacitive based micromachined mass sensors. This research gives a review on the foundation for capacitive based micromachined mass sensors while highlighting the potential capabilities of each geometric design to be developed further. Moreover, this paper also introduces the advancements based on the geometric designs of the capacitive based micromachined mass sensors. An in-depth analysis is done for each geometric design, to identify the critical design parameters, which affect the sensors’ performances. Furthermore, the theoretically achievable mass sensitivity for each capacitive based micromachined mass sensor is modeled and analyzed using finite element analysis with mass variation in the picogram range. Finally, a critical analysis is done on the sensor sensitivities and further discussed in detail wherein each design is compared to each other and its current advances. Additionally, an insight to the advantages and disadvantages associated with each simulated geometry and its different advances are given. The results of the investigative review and analysis indicate that the sensitivities of the capacitive based micromachined sensors are dependent not only on the material composition of the devices but also on the varying degrees of clamping between the sensor geometries. In essence, the paper provides future research the groundwork to choose proper candidate geometry for a capacitive based micromachined mass sensor, with its several advantages over other mass sensors, based on the needed application.

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“…Currently, PMMA bonding mainly consists of two methods: direct bonding and indirect bonding, with direct bonding widely used due to the advantage of high optical clarity at the bonding interface. Direct bonding includes thermal bonding [13,14], UV or microwave-assisted bonding [15][16][17][18], as well as solvent bonding [19]. In 2009, Mathur et al [20] began using PMMA for thermal compression bonding to manufacture microfluidic channels and devices.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of a Three-Dimensional Microfluidic System from Poly(methyl methacrylate) (PMMA) Using an Intermiscibility Vacuum Bonding Technique

Li,

Chiang,

Tsai

et al. 2024

Micromachines

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In this study, the fabrication of microfluidic chips through the bonding of poly (methyl methacrylate) (PMMA) boards featuring designed patterns to create a three-dimensional sandwich structure with embedded microchannels was explored. A key focus was optimization of the interface quality of bonded PMMA pairs by adjusting the solvent, such as such as acetone, alcohol, and their mixture. Annealing was conducted below 50 °C to leverage the advantages of low-temperature bonding. Because of the differences in the chemical reactivity of PMMA toward acetone, alcohol, and their combinations, the resulting defect densities at the bonding interfaces differed significantly under low-temperature annealing conditions. To achieve the optimal sealing integrity, bonding pressures of 30 N, 40 N, and 50 N were evaluated. The interface was analyzed through microstructural examination via optical microscopy and stress measurements were determined using digital photoelasticity, while the bonding strength was assessed through tensile testing.

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PMMA-Based Wafer-Bonded Capacitive Micromachined Ultrasonic Transducer for Underwater Applications

Cited by 5 publications

References 41 publications

A Novel Seedless TSV Process Based on Room Temperature Curing Silver Nanowires ECAs for MEMS Packaging

A Novel Seedless TSV Process Based on Room Temperature Curing Silver Nanowires ECAs for MEMS Packaging

Capacitive Based Micromachined Resonators for Low Level Mass Detection

Fabrication of a Three-Dimensional Microfluidic System from Poly(methyl methacrylate) (PMMA) Using an Intermiscibility Vacuum Bonding Technique

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