2022
DOI: 10.1016/j.apsusc.2021.151345
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Platinum silicide formation on selected semiconductors surfaces via thermal annealing and intercalation

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Cited by 7 publications
(3 citation statements)
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“…Подобные структуры характеризуются сложностью конструкции и изготовления, что определяет их высокую стоимость. Существуют также датчики на основе диодов Шоттки, например на основе силицида платины [4], фотоприемники на основе термоэлектрического эффекта [5], а также пироэлектрические [6].…”
Section: Introductionunclassified
“…Подобные структуры характеризуются сложностью конструкции и изготовления, что определяет их высокую стоимость. Существуют также датчики на основе диодов Шоттки, например на основе силицида платины [4], фотоприемники на основе термоэлектрического эффекта [5], а также пироэлектрические [6].…”
Section: Introductionunclassified
“…For example, ohmic contact with the lightly doped thin device layer is best achieved by the formation of a thin layer of PtSi alloys at the interface of Ta/Pt and silicon. However, this process is too sensitive to the thickness of the silicide formation and the annealing temperature to provide reproducible results with our device layer thickness [ 22 , 23 , 24 , 25 , 26 , 27 , 28 , 29 ]. We have overcome this issue by optimization of the annealing process to get a reliable planar junctionless FET device, and in the end, we have demonstrated the pH sensing performance of our fabricated device.…”
Section: Introductionmentioning
confidence: 99%
“…The direct deposition of Pt on oxide or nitride substrates results in the low stability of such systems at high temperatures [ 26 , 27 ] due to poor adhesion leading to the delamination of the metal from the substrate [ 27 , 28 ]. The chemical interaction of Pt with silicon-based substrates [ 29 , 30 ] is also possible. A thin adhesion layer with a high affinity for oxygen allows one to solve these problems being introduced between the resistive layer and the substrate.…”
Section: Introductionmentioning
confidence: 99%